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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK CGA2B2C0G1H150JT0Y0F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK CGA2B2C0G1H150JT0Y0F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B2C0G1H150JT0Y0F
- Electronic Component
- 1
- Electronic Component
- 15pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0257330532
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA2B2C0G1H150JT0Y0F 产品概述
一、产品简介
TDK 型号 CGA2B2C0G1H150JT0Y0F 为片式多层陶瓷电容器（MLCC），封装为 0402（公制 1005），容量 15 pF，容差 ±5%（J），额定电压 50 V，介质特性为 C0G（又称 NP0）。该系列以温度稳定性高、介电损耗低著称，适合高频和精密电路使用。
二、主要特性
- 容量：15 pF；容差：±5%（J）
- 额定电压：50 V DC
- 介质：C0G（温度系数典型值 ±30 ppm/℃，线性稳定）
- 尺寸：0402（小型化、适合高密度贴装）
- 损耗角正切（DF）低，Q 值高，电压系数极小，温漂和频率特性优异
- 低自谐频率，高频表现稳定，耐焊接温度适用于无铅回流工艺
三、典型应用
- 高频电路：射频匹配、调谐电路、滤波器
- 高频振荡器与时钟电路中的定容元件
- 精密模拟电路的耦合与定时网络
- 对高频噪声敏感的去耦/旁路场合（小容量并联用于改善高频性能）
- 航空航天、仪器仪表及工业控制等对温漂和可靠性要求高的系统
四、选型与注意事项
- 若需更高电压或不同容差，请根据实际电路条件选择相应规格；大电压下介电常数会有轻微电压系数，C0G 表现优于高介电常数材料。
- 0402 尺寸适合密集贴装，但手工焊接和维修难度较大，建议使用自动贴片与回流焊工艺。
- 对于极低噪声或极高 Q 的要求，应同时关注封装寄生电感与 PCB 布局对性能的影响。
五、焊接与可靠性
- 建议按照制造商回流曲线进行焊接（无铅回流峰值温度通常在 260±5°C 范围内，具体参考 TDK 数据表）。
- 注意 PCB 焊盘设计与应力缓释，避免板弯曲或冷却不均导致元件应力。
- 常见可靠性测试包括高低温循环、湿热、焊接热稳定性和机械冲击/振动，符合工业级应用要求。
六、替代与采购信息
- 同类产品可参考 Murata（GRM）、Samsung、KEMET 等厂商的 C0G/NP0 0402 小容量系列，但选型时应对比温漂、损耗和额定电压等参数。
- 采购时注意完整料号、包装卷带规格及批次一致性，必要时索取元器件认证与原厂质量证明以满足可靠性需求。
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