Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S3N0BT000 是由 TDK 公司生产的高性能贴片电感,属于多层陶瓷电感系列。该产品以其小尺寸、低失耗和高频性能而闻名,广泛应用于各种电子设备中的高频滤波、匹配和能量存储等场景。
小尺寸设计: MLG1005S3N0BT000 采用 0402 封装,这使得它非常适合用于空间有限的现代电子设备中。其小尺寸不仅节省了 PCB 布局空间,还能提高整体系统的集成度和可靠性。
高频性能: 该电感在 100 MHz 时具有高 Q 值(7),这意味着它在高频应用中具有低能量损耗和高效能传输能力。同时,其自谐振频率高达 5.5 GHz,确保在宽频带范围内保持稳定和高效的工作状态。
高额定电流: MLG1005S3N0BT000 的额定电流为 800 mA,这使得它能够处理较高的电流需求,适用于需要高电流处理能力的应用场景,如无线通信设备、功率管理模块等。
宽工作温度范围: 该电感能够在 -55°C ~ 125°C 的广泛温度范围内稳定工作,这使得它非常适合用于各种环境条件下的应用,包括汽车电子、工业控制和航空航天等领域。
低 DC 电阻: 最大 DC 电阻为 200 毫欧,这降低了能量损耗,提高了系统的整体效率和可靠性。
精确容差控制: 电感值的容差仅为 ±0.1 nH,这确保了产品在批量生产过程中的一致性和可靠性,特别是在需要精确匹配和滤波的应用中。
MLG1005S3N0BT000 是一款高性能、紧凑设计的多层陶瓷电感,通过其优异的高频特性、低失耗和宽工作温度范围,成为现代电子设备中不可或缺的组件。其广泛的应用领域和出色的性能特点,使其成为开发人员和工程师在设计高效、可靠的电子系统时的首选选择。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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