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TDK C1005X7R1E104KT000F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK C1005X7R1E104KT000F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C1005X7R1E104KT000F
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0230945701
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1005X7R1E104KT000F 产品概述
一、主要参数
- 品牌：TDK
- 型号：C1005X7R1E104KT000F
- 容值：100 nF (0.1 μF)
- 精度：±10% (K)
- 额定电压：25 V DC
- 温度特性：X7R（-55°C 到 +125°C）
- 封装：0402（公制约 1.0 mm × 0.5 mm，厚度依具体系列略有差异）
- 封装形式：常见为卷带（Tape & Reel），便于贴片生产线使用
二、产品特性
该器件为多层陶瓷贴片电容（MLCC），X7R 介质在宽温度范围内保持较好的电容稳定性，适合通用去耦、旁路与滤波应用。0402 小尺寸封装具有高贴片密度优势，电容等效串联电阻（ESR）和等效串联电感（ESL）较低，利于高速瞬态抑制。需注意 X7R 存在温漂及直流偏压下电容下降（DC bias）现象，工作时应予以评估。
三、典型应用场景
- 电源去耦与旁路（芯片、稳压器输入/输出）
- 高频滤波与去耦网络
- 移动终端、通信设备、物联网模块等高密度贴片电路
- 一般消费类与工业电子产品的耦合/滤波场景
四、封装与布局建议
0402 封装适合高密度布板，但对贴装与回流工艺敏感。建议：
- 采用与制造商推荐的焊盘尺寸匹配的 PCB land pattern；
- 去耦电容应尽量靠近被旁路器件的电源引脚铺设，缩短回流路径；
- 多个去耦电容可并联以覆盖不同频段的噪声抑制。
五、焊接与存储注意
- 本品可用于无铅回流焊工艺，具体回流温度曲线请参照 TDK Datasheet；
- 防潮管理：长时间暴露在潮湿环境下需按制程规定进行烘烤处理并遵循制造商的 MSL 要求；
- 贴装时避免过大机械应力（弯曲、挤压），防止裂纹导致失效。
六、选型要点与工程建议
- 若电路中工作电压接近或等于 25 V，应评估 DC bias 对有效电容的影响，必要时选择更高额定电压或更大容值以补偿容量损失；
- 对温度敏感或需要更高稳定性的场合，可考虑 C0G/NP0 或温度系数更好的介质；
- 批量采购时建议向供应商索取最新 datasheet 与样品进行实际电气与热循环测试。
七、质量与采购
TDK 为全球知名被动元件厂商，产品有完善的质量控制与追溯体系。采购时确认完整型号与包装代码，与生产工艺匹配；如用于关键或长期供货项目，建议签订长期供货协议并留取充足备货以降低替代风险。
注：本文为产品概述性说明，所有工艺参数、封装尺寸与具体可靠性数据请以 TDK 官方 Datasheet 为准，并在设计中按实际应用进行验证。
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