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TDK CGA1A2X7R1H471KT0YNN
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK CGA1A2X7R1H471KT0YNN
- Type
- TDK
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA1A2X7R1H471KT0YNN
- Electronic Component
- 1
- Electronic Component
- 470pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Electronic Component
- BM0259459647
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK CGA1A2X7R1H471KT0YNN 产品概述
一、概述
TDK CGA1A2X7R1H471KT0YNN 为超小型贴片多层陶瓷电容（MLCC），规格为 470 pF ±10%，额定电压 50 V，介质类型 X7R，封装 0201。该型号适用于在空间受限、需要高装配密度的现代电子设备中做旁路、滤波和耦合等通用电容应用。
二、主要参数
- 电容值：470 pF
- 公差：±10%
- 额定电压：50 V
- 介质：X7R（温度范围与容值变化受 X7R 特性限制）
- 封装：0201（超小型表面贴装）
- 品牌：TDK，型号：CGA1A2X7R1H471KT0YNN
三、产品特点
- 体积极小，利于高密度贴装和轻薄化设计；
- X7R 介质在 -55 ℃ 至 +125 ℃ 范围内工作，容值变化相对稳定，适合一般电子电路的去耦和旁路；
- 额定 50 V，适用于中等电压场合；
- MLCC 具有低等效串联电阻（ESR）与良好高频特性，适合高速信号和电源滤波；
- 需注意 X7R 为高介电常数材料，存在直流偏压（DC bias）导致实际容值下降的现象，设计时应考虑去耦裕量。
四、典型应用
- 移动终端与可穿戴设备的电源去耦与旁路；
- 滤波、耦合网络和阻抗匹配中的非精密定容场合；
- 高密度主板、模块化电源和射频前端中对体积敏感的布板区域。
五、安装与注意事项
- 推荐采用标准回流焊工艺；避免过长热暴露或重复加热以防机械应力和裂纹；
- 贴装时尽量减小板弯曲与焊点拉力，0201 封装对机械应力敏感；
- 储存与清洗遵循常规电子元器件规范，避免潮湿与有害化学品侵蚀；
- 设计时应考虑 X7R 的温度与直流偏置特性，关键精密或高稳定度电路建议选用温度系数更优的介质。
如需详细尺寸、焊接曲线或完整电气特性曲线，建议参照 TDK 官方数据手册或联系供应商获取原厂资料。
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