Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MMZ1005S102CT000
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MMZ1005S102CT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MMZ1005S102CT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0211333715
- Operating Temperature
- 55℃~+125℃
- Current
- 200mA
- @Frequency
- 1kΩ@100MHz
- Resistor(DCR)
- 750mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMZ1005S102CT000 产品概述
一、产品简介
MMZ1005S102CT000 是 TDK 出品的一款表面贴装磁珠（ferrite bead），封装为 0402（公制 1005）。该器件主要用于高频干扰抑制与电源/信号滤波，典型参数：阻抗 1kΩ @ 100MHz，直流电阻（DCR）约 750mΩ，额定电流 200mA，阻抗公差 ±25%，工作温度范围 -55℃ 至 +125℃，单通道（1 通道）。描述简明：磁珠 1kΩ@100MHz 750mΩ ±25% 200mA。
二、主要特性
- 高频阻抗高：在 100MHz 时阻抗 1kΩ，适合抑制射频及开关噪声。
- 低直流电阻：DCR 750mΩ，电压降小，适用于对压降敏感的电源线微滤。
- 小封装：0402/1005 适合集成度高的移动与便携设备。
- 宽温区间：-55℃~+125℃，适用于多种工业与消费级环境。
- 额定电流 200mA，适合低功耗电路及信号线使用。
三、典型应用
- 手机、平板、可穿戴设备的射频/开关噪声抑制；
- USB、HDMI、摄像头等高速信号线的共模/差模干扰抑制（串联使用）；
- 电源输入或局部电源支路的 EMI 预过滤；
- IoT、无线模组周边的滤波与 EMC 优化。
四、选型与注意事项
- 频率匹配：阻抗标注为 100MHz 点的数据，若目标噪声频率显著偏移，请查阅频率响应曲线选择合适型号。
- 电流与自热：额定电流 200mA，长期接近额定值会产生温升并降低阻抗，需留有裕量。
- 阻抗公差 ±25%，实际电路应考虑最坏情况的滤波效果。
- DCR 虽低但非零，串联在低压差电路时应评估电压降和功耗。
五、封装与焊接建议
- 0402 小封装，推荐贴片机与标准回流焊工艺。
- 布局：尽量靠近噪声源或器件电源引脚串联放置，避免在滤波点后增加长导线。
- 焊盘设计遵循厂家推荐尺寸以保证焊接可靠性与机械强度。
六、可靠性与测试建议
- 生产测试：使用阻抗分析仪在目标频点（如 100MHz）测量阻抗曲线，DCR 可用四线法测量确认。
- 环境可靠性：遵循常规 SMT 元件储存与回流规范，避免潮湿环境长期存放；如有严格要求请参照 TDK 的可靠性数据表。
七、采购与替代
- 型号：MMZ1005S102CT000，品牌：TDK，描述：磁珠 1kΩ@100MHz 750mΩ ±25% 200mA，封装：0402。
- 包装：常见为卷带（reel）包装，便于SMT贴装。
- 替代：同类规格可参考其他厂商的 0402 高频磁珠，但在阻抗曲线、额定电流和 DCR 上尽量匹配以保证滤波效果。
以上信息为该器件在电路设计与生产应用中的要点汇总，如需频率响应曲线、失效数据或推荐焊盘尺寸，可提供具体数据表进一步确认。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
