Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA2B3X7R1H333KT0Y0F 是由日本著名电子元器件制造商 TDK 生产的一款高性能贴片电容(MLCC),属于其广泛的多层陶瓷电容产品系列。以下是对此产品的详细介绍。
此电容采用 X7R 材质,这是一种常见的陶瓷介质材料,具有良好的温度稳定性。X7R 的温度系数意味着在 -55°C 到 +125°C 的温度范围内,电容值的变化不会超过 ±15%。这种特性使得 CGA2B3X7R1H333KT0Y0F 适用于各种需要稳定性能的应用场景。
电容的容值为 33 nF,精度为 ±10%。这种精度水平适用于大多数电子设备中的滤波、耦合和储能应用。对于需要更高精度的应用,可以考虑其他选项,但对于大多数通用用途,±10% 的精度是足够的。
CGA2B3X7R1H333KT0Y0F 的额定电压为 50 V,这意味着它可以在高达 50 V 的工作电压下运行而不会出现击穿或其他故障。这种高额定电压使得此电容能够在各种高压应用中使用,例如电源滤波、信号处理和保护电路。
此电容采用 0402 封装,这是一种非常小巧的贴片封装,尺寸为 0.04 x 0.02 英寸。这种小尺寸使得它非常适合用于现代电子设备中的空间有限的设计,例如智能手机、平板电脑、穿戴设备以及其他便携式电子产品。
在电源系统中,CGA2B3X7R1H333KT0Y0F 可以用于滤除噪声和纹波,确保稳定的输出电压。其高额定电压和良好的温度稳定性使得它特别适合用于高压电源应用。
在信号处理应用中,如音频和视频设备中,CGA2B3X7R1H333KT0Y0F 可以作为耦合电容或滤波电容,帮助去除干扰信号并保持信号质量。
由于其较高的容值和稳定的性能,CGA2B3X7R1H333KT0Y0F 也可以用于储能应用,如缓冲电源或暂时性电源供应。
CGA2B3X7R1H333KT0Y0F 是一款高性能、多功能的贴片电容,适用于广泛的电子设备应用。其优异的温度稳定性、 高额定电压和小尺寸封装,使其成为现代电子设计中的理想选择。无论是在电源系统、信号处理还是储能应用中,这款电容都能提供可靠和稳定的性能。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products