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TDK MLG0603PR10HT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG0603PR10HT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603PR10HT000
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.009g
- Inductor
- 100nH
- Electronic Component
- 1
- Factor
- 9@300MHz
- Electronic Component
- BM0262575911
- Current
- 80mA
- Frequency
- 900MHz
- Resistor(DCR)
- 3.2Ω
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603PR10HT000 产品概述
一、产品简介
MLG0603PR10HT000 为 TDK 系列贴片电感，标称电感值 100 nH，容差 ±3%，额定直流电流 80 mA，直流电阻（DCR）3.2 Ω，品质因数 Q=9（@300 MHz），自谐振频率（SRF）约 900 MHz。封装标注为 0201，适用于对体积和高频性能有严格要求的微型化电子产品。
二、主要电气参数
- 电感值：100 nH ±3%
- 额定电流：80 mA（连续）
- 直流电阻（DCR）：3.2 Ω（较高）
- 品质因数：Q=9 @300 MHz（适中）
- 自谐振频率：900 MHz（可覆盖 UHF 及以下频段）
该器件在高频区表现为感性阻抗上升，至自谐点后出现容性特性，适合用于高频匹配与抑制。
三、性能与应用建议
由于 DCR 值偏高，器件在低频直流或大电流场景下会有显著功耗与压降，因此不推荐作为大电流电源滤波元件。适用场景包括：
- RF/微波匹配网络中的小信号电感
- 高频 EMI 滤波、共模/差模阻断（配合其他元件）
- 天线匹配与阻抗调谐（注意功率与线性度限制）
- 高密度射频模块与便携式设备的信号处理电路
四、封装与贴装注意
0201 尺寸的贴片电感对贴装精度和回流工艺要求高：
- 推荐采用精密贴装机与 0201 专用吸嘴；手工焊接风险大，可能损伤器件。
- 回流温度曲线应遵循供应商推荐的统一曲线，避免超温或长时间高温。
- PCB 布局上尽量将电感置于器件引脚或信号路径近侧，减少走线长度和寄生电容；同时为焊盘留出良好湿润面积以保证焊接可靠性。
五、测试与可靠性
在设计验证阶段应关注以下测试：
- 直流电阻测量以确认系列一致性与焊接质量。
- S-参数测量（S11、S21）评估在目标频段的插入损耗、反射与匹配情况。
- 温升与寿命测试（在额定电流下长期验证热稳定性）。
- 机械可靠性测试（振动、冲击、热循环、湿热）以验证贴片在实际环境中的可靠性。
六、选型与采购提示
- 型号名含 MLG0603 字样时通常暗示 0603 尺寸，请在下单前与供应商确认实际封装（用户提供为 0201），以避免误采购。
- 对功耗与电流裕度敏感的应用，应选用更低 DCR 或更高额定电流的器件。
- 小封装器件受焊盘、走线和回流工艺影响明显，建议向制造商索取推荐的 PCB 厚度与焊盘尺寸图纸。
总体而言，MLG0603PR10HT000 以其小体积与接近 GHz 频段的自谐特性，适合微型射频与 EMI 抑制应用；但其较高的 DCR 与较低额定电流要求在使用前做好电气与热性能验证。
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