WMSIC Electronic Components

TDK TFSC06054125-2120A1X TFSC06054125

ModelTFSC06054125-2120A1X
PackageSMD-4P,0.7x0.5mm
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TDK TFSC06054125-2120A1X
Type
TDK
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
TFSC06054125-2120A1X
Electronic Component
1
Package
SMD-4P,0.7x0.5mm
Electronic Component
RF Coupler
Electronic Component
0.012g
Frequency
5.15GHz~5.85GHz;2.4GHz~2.5GHz
Electronic Component
1
Features
Electronic Component
Electronic Component
BM69416142
Electronic Component
20.83dB
Operating Temperature
40℃~+85℃
Electronic Component
0.5dB
Electronic Component
18.6dB
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TFSC06054125-2120A1X 产品概述

一、产品背景

在现代无线通信系统中,射频(RF)技术的应用越来越广泛,从日常的Wi-Fi、蓝牙到更复杂的无人驾驶、物联网(IoT)设备,射频元器件的需求持续增长。作为无线通信链路中重要的组成部分,定向耦合器能够有效地分配和监测信号的传输,是实现高效和可靠性能的关键因素。TDK推出的TFSC06054125-2120A1X射频定向耦合器,专为2.4GHz ~ 2.5GHz和5.15GHz ~ 5.85GHz频段设计,满足了市场对高性能RF耦合器的迫切需求。

二、产品规格

  • 工作频率:TFSC06054125-2120A1X的工作频率涵盖了2.4GHz至2.5GHz和5.15GHz至5.85GHz两个频段。这使得该耦合器能够广泛应用于多种无线通信技术,如Wi-Fi、蓝牙和其他RF设备,提供良好的信号传输和隔离性能。

  • 回波损耗:具有高达35.8dB的回波损耗,表明该耦合器在信号反射控制和传输效率方面表现出色,能够有效减少信号损失,提高系统的整体性能。

  • 功率处理能力:最大功率为3W,适用于多个RF应用场景。在高功率信号环境下,该耦合器能够稳定运行,为系统提供更可靠的传输解决方案。

  • 插损:插损为0.34dB,这意味着TFSC06054125-2120A1X能够以极小的信号损失进行信号传递,进一步确保了信号的完整性和稳定性。

  • 耦合系数:耦合系数为19.4dB,提供了良好的耦合性能,便于用户对信号进行监测与分析,同时可以支持反馈和控制功能。

  • 封装形式:采用0202(0505)公制封装,为产品在电路板上的集成提供了便利,尤其适合对尺寸有严格要求的应用场合。

三、应用范围

TFSC06054125-2120A1X被设计用于通用RF应用,适合以下领域:

  1. Wi-Fi & 蓝牙设备:广泛用于无线网络设备和蓝牙通信模块,提供稳定的信号传输与监测。

  2. 物联网(IoT)设备:其优良的频率特性和功率处理能力使其在各类智能设备中,提升了数据传输的可靠性。

  3. 通信基础设施:如基站、路由器等关键设备中,TFSC06054125-2120A1X能够有效隔离信号并保持高传输效率,确保系统的稳定运行。

  4. 测试与测量设备:适合在无线信号检测与分析设备中使用,提供精准的信号监测与反馈。

四、总结

TDK推出的TFSC06054125-2120A1X射频定向耦合器是一个性能优异且应用广泛的RF元件,具有高达35.8dB的回波损耗、0.34dB的低插损和3W的功率处理能力,完美满足现代无线通信的需求。其适用的频率范围和高耦合系数,使得它在各种应用中均能表现出色,为客户提供了理想的信号分配与监测解决方案。

在面对不断增长的无线通信市场需求时,TFSC06054125-2120A1X将为客户带来更高的性价比选择和更优质的使用体验。无论是在工程设计、通信测试还是日常使用中,这款RF耦合器都将是不可或缺的强大工具。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.