WMSIC Electronic Components

TDK MLG0603P33NHT000

ModelMLG0603P33NHT000
Package0201
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MLG0603P33NHT000
Type
TDK
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLG0603P33NHT000
Electronic Component
1
Package
0201
Electronic Component
SMD Inductor
Electronic Component
±3%
Electronic Component
0.009g
Inductor
33nH
Electronic Component
1
Factor
10@300MHz
Electronic Component
BM0220961875
Current
130mA
Frequency
1.8GHz
Resistor(DCR)
1.55Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MLG0603P33NHT000 产品概述

产品简介

MLG0603P33NHT000 是由世界知名电子元件制造商 TDK 提供的一款高性能表面贴装电感器,采用0201(0603公制)小型封装设计。该电感器非常适合在空间受限的应用中使用,特别是在高速数字电路和射频(RF)应用中表现卓越。

基础参数与规格

  • 电感值: 33nH
  • 容差: ±3%
  • 额定电流: 130mA
  • DC电阻 (DCR): 最大2.2Ω
  • Q值: 在300MHz时为10,表明其在该频段的性能较好,适合用于高频信号处理。
  • 自谐振频率: 1.8GHz,说明其在超过此频率后会进入失谐状态,适合高频应用中对信号的处理。
  • 操作温度范围: -55°C至125°C,确保在极端环境下的稳定性能。
  • 安装类型: 表面贴装型适配多种现代电路板设计,为设计提供灵活性。
  • 尺寸: 0.024" 长 x 0.012" 宽(0.60mm x 0.30mm),以紧凑的尺寸解决复杂装修中的空间限制问题。

应用场景

MLG0603P33NHT000 电感器适合广泛的应用领域,尤其是在高频和功率敏感的电路中,主要应用包括:

  • 射频(RF)电路: 在无线传输、信号放大和接收设备中,优良的Q值确保信号传输的稳定性。
  • 数字电路: 由于其小型封装和良好的电感特性,能够有效地降低信号噪声,提升信号完整性,常见于计算机、移动设备和其他电子产品中。
  • 功率管理系统: 在DC-DC转换器中,帮助稳定输出电压并降低电源噪声。
  • 滤波器: 在音频设备中,有助于去除不必要的频率,并增强音质。

性能优势

  1. 小型化设计: 0201封装尺寸使其在现代超小型电子设备中得以广泛应用,特别是在手机、穿戴设备和物联网设备中。
  2. 高频性能: Q值和自谐振频率的设计使其特别适用于高速信号传输,能有效减少信号衰减,并提高系统的整体性能。
  3. 温度适应性: 宽广的工作温度范围使其能在各种极端环境下保持稳定工作,特别适合汽车电子和工业自动化设备。
  4. 可靠性: TDK品牌保证了其在制造过程中严格的质量控制,使其长期使用中表现出色,降低了系统故障的风险。

总结

MLG0603P33NHT000 是一款结合了小体积、高性能和广泛适用性的优质贴片电感器,特别适合用于高频和高密度的电路设计中。其优越的电感特性、宽广的工作温度和可靠的性能,使其成为现代电子设备中不可或缺的重要组件。无论是在通讯、消费电子还是工业控制领域,MLG0603P33NHT000 都是设计工程师值得信赖的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.