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TDK CGA2B2X7R1C224KT000F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK CGA2B2X7R1C224KT000F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B2X7R1C224KT000F
- Electronic Component
- 1
- Electronic Component
- 220nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0259459649
- Electronic Component
- X7R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA2B2X7R1C224KT000F 产品概述
一、产品简介
TDK CGA2B2X7R1C224KT000F是一款贴片多层陶瓷电容（MLCC），标称电容值220nF，容差±10%，额定电压16V，介质体系为X7R，封装尺寸为0402（约1.0mm × 0.5mm）。该系列面向体积受限的高密度贴片电路，兼顾容量与温度/频率特性，适用范围广泛。
二、主要电气性能
- 容值：220nF（0.22µF），±10%公差，适合旁路、耦合与去耦应用。
- 额定电压：16V，满足一般低压电源与信号链电压需求。
- 介质：X7R（-55°C至＋125°C温度范围内容值变化典型在±15%内），属于Ⅱ类介质，在容量密度与温度稳定性之间取得平衡。
- 小封装带来较低引线电感和较短电流回路，有利于高频旁路和瞬态响应，但在施加直流偏压时容值会有明显下降。
三、典型应用
- 电源去耦与滤波（稳压器输入/输出、DC-DC转换器旁路）
- 模拟信号耦合/旁路（音频前端、ADC/DAC电源抑制）
- 移动设备、可穿戴、物联网终端以及高密度主板上的局部去耦与旁路。
四、设计与使用要点
- DC偏压效应：X7R在接近额定电压时容值会降低，设计时应考虑有效容值下降，关键电路建议测量工作电压下的实际容值。
- 温度与频率依赖：高频下容容下降，低温时容值会偏离标称，关键系统需基于工作环境评估性能。
- 封装限制：0402体积小，储能与电流承载有限，适合去耦但不适合做高能量滤波器或大电流旁路件。
- 推荐贴装：采用回流焊工艺，遵循制造商回流曲线，避免过度机械应力与频繁重复加热。
五、可靠性与存储
- 存储环境应干燥、避免高温高湿及腐蚀性气体，开封后的卷带元件建议在规定期限内使用并做防潮处理。
- 贴片电容对焊接、夹持及基板弯曲敏感，PCB设计应避免在装配或使用过程中产生应力集中。
- 通常符合无铅/RoHS等环保要求，具体认证与可靠性试验可参考TDK产品资料。
六、选型建议与替代
在选择时注意评估工作电压下的实际容值、温度与频率响应以及机械安装应力。若需备选品牌，可在Murata、KEMET、Samsung等厂商的0402 X7R 220nF/16V系列中寻找性能相近的替代型号，注意比较DC bias曲线与寿命测试数据。
七、包装与采购
本产品常见卷带包装（Tape & Reel），适合SMT高速贴装。采购时确认包装单位、批次及制造商认证，必要时索取元件实测报告与可靠性数据。
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