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TDK MLG1005SR22HT000
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005SR22HT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005SR22HT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.012g
- Inductor
- 220nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0255023668
- Current
- 100mA
- Frequency
- 450MHz
- Resistor(DCR)
- 3.02Ω
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005SR22HT000 产品概述
一、主要参数
- 型号：MLG1005SR22HT000
- 品牌：TDK
- 封装：0402（1005英制）
- 电感值：220 nH，公差 ±3%
- 额定直流电流：100 mA
- 直流电阻（DCR）：3.02 Ω
- 品质因数（Q）：8（@100 MHz）
- 自谐振频率（SRF）：450 MHz
二、性能特点
该器件为超小型贴片电感，体积仅为0402，适合空间受限的高密度电路板。220 nH 的电感量配合 ±3% 精度，能提供稳定的感性阻抗。Q 值在 100 MHz 时约为 8，表明中高频下品质适中；SRF 在 450 MHz，超过此频率器件将表现出容性特性。DCR 值为 3.02 Ω，较大直流电阻意味着在需要低损耗或大电流传输 的场合需谨慎选用。
三、典型应用场景
- 高频 EMI 抑制与共模/差模滤波（对电流要求不高的信号线）
- 射频电路中的偏置网络或阻抗微调（在允许一定插入损耗的情况下）
- 小型便携式设备的信号滤波与抑噪模块
不建议用于高电流功率滤波或要求极低串联电阻的电源应用。
四、封装与安装建议
0402 尺寸对印制板焊盘设计和回流工艺敏感，建议参考制造商推荐焊盘和回流曲线。焊接时避免长时间高温和重复回流，以减少机械应力和参数漂移。贴装前后注意清洁，避免残留助焊剂影响可靠性。实现良好焊接时，注意器件方向及温升对电感值的影响。
五、选型与注意事项
- 若电路对插入损耗或直流压降敏感，需重新评估 DCR 的影响或选用低阻抗型号；
- 在靠近 SRF 的工作频段应进行群体测试，考虑 PCB 寄生电容/电感的耦合；
- 对长期可靠性、温度漂移、过电流余量等有严格要求时，应参考完整厂商数据手册并做实际工况测试。
总体而言，MLG1005SR22HT000 适合空间受限且对电流不高、容许一定损耗的高频抑噪与滤波场合，选型时以 DCR、Q 和 SRF 与实际电路要求匹配为准。
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