Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MLF2012A2R2JT000
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLF2012A2R2JT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLF2012A2R2JT000
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.042g
- Inductor
- 2.2uH
- Electronic Component
- 1
- Factor
- 45@10MHz
- Electronic Component
- BM0007172972
- Current
- 50mA
- Frequency
- 80MHz
- Resistor(DCR)
- 220mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：MLF2012A2R2JT000 贴片电感器
MLF2012A2R2JT000是一款优质的表面贴装电感器，特别设计用于现代电子应用，能够满足各种高性能电路的需求。它由知名品牌TDK制造，以其卓越的品质和可靠性而闻名。以下是这款电感器的详细规格分析及应用场景。
产品规格
- 类型：多层电感
- 材料 - 磁芯：铁氧体
- 电感值：2.2µH
- 容差：±5%
- 额定电流：50mA
- 屏蔽：具备屏蔽设计，能够有效降低电磁干扰（EMI）
- DC 电阻 (DCR)：最大500毫欧
- Q 值：在10MHz时为45，表明其在高频下的良好性能
- 自谐振频率：80MHz，适合高频应用
- 工作温度范围：-55°C至125°C，适用于恶劣环境
- 频率 - 测试：在10MHz下进行电感值测试
- 安装类型：表面贴装型（SMD），便于自动化生产
- 封装/外壳尺寸：0805（2012公制），小巧灵活，适合多种电路板设计
- 物理尺寸：0.079" 长 x 0.049" 宽（2.00mm x 1.25mm），高度最大1.05mm（0.041"）
应用场景
MLF2012A2R2JT000 贴片电感器的设计使其适用于广泛的电子设备和应用领域。以下是一些主要的应用场景：
- 射频(RF)电路：由于其高Q值和自谐振频率，适合于射频信号处理和天线匹配电路。
- 电源管理：在DC-DC转换器和降压转换器中作为滤波器使用，以平滑输出电流，减少纹波。
- 通信设备：广泛应用于无线通信设备中，用于信号的滤波和调谐，提升信号质量。
- 便携式电子产品：其小巧的封装和低功耗特性，使其成为笔记本电脑、智能手机等便携式设备中理想的组件。
- 汽车电子：能够承受高温和恶劣环境，适合汽车中的传感器和控制模块。
性能优势
- 高可靠性：采用优质铁氧体材料和多层结构设计，增强了耐用性和稳定性。
- 优秀的电磁兼容性：其屏蔽设计显著降低了对周围电路的干扰，确保了系统的整体性能。
- 高温特性：宽温度范围使得该电感器可以在不同行业中自由应用，特别是在工业和汽车环境下。
- 小尺寸设计：0805封装使得其在有限的电路板空间内依然能够有效配置，满足紧凑型设计需求。
总结
MLF2012A2R2JT000 贴片电感器是一款功能强大、灵活多变的组件，能够满足现代电子设计的复杂需求。随着电子设备向轻量化和高性能化发展，该电感器凭借其优良的电参数和设计，必将在多个领域中发挥重要作用。无论在消费电子、工业设备还是汽车电子中，MLF2012A2R2JT000都将是提升产品品质和性能的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
