Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK DEA102700LT-6307A2 DEA102700LT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK DEA102700LT-6307A2
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- DEA102700LT-6307A2
- Electronic Component
- 1
- Package
- SMD-4P,1x0.5mm
- Electronic Component
- RFFilter
- Electronic Component
- 26dB
- Electronic Component
- 0.012g
- Electronic Component
- 50Ω
- Electronic Component
- 1
- Electronic Component
- BM0228288740
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 0.45dB
- Electronic Component
- 2.4GHz~2.7GHz
- Filter Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DEA102700LT-6307A2 产品概述
一、简介
DEA102700LT-6307A2 是 TDK 面向 2.4GHz 无线通信的表面贴装低通滤波器，专为 Wi‑Fi/蓝牙/IoT 等 2.4GHz 频段应用优化。器件体积小（SMD-4P，封装尺寸约 1.0 × 0.5 mm），便于在紧凑射频前端布局中使用，提供稳定的通带性能和有效的带外抑制。
二、主要特性
- 低通滤波类型，通带覆盖 2.4GHz–2.7GHz（绝对带宽）；
- 通带插入损耗典型值 0.45 dB，保证信号透传性能；
- 标称特性阻抗 50Ω，便于与常见射频链路直接匹配；
- 带外衰减 ≥26 dB，可有效抑制高频干扰与谐波；
- 工作温度范围 -40℃ 至 +85℃，适应工业级温度要求；
- 超小型 SMD-4P 封装，利于高密度 PCB 设计。
三、电气参数概览
- 滤波类型：低通；
- 绝对带宽：2.4–2.7 GHz；
- 插入损耗：0.45 dB（典型）；
- 阻抗：50 Ω；
- 衰减：26 dB（带外）；
- 工作温度：-40℃ 至 +85℃。
四、典型应用
- 2.4 GHz Wi‑Fi（802.11b/g/n）射频前端；
- 蓝牙／BLE 无线模块；
- ZigBee、Thread、无线传感器网关与 IoT 终端；
- 无线视频传输及其他短距离射频系统。
五、设计与布局建议
- 将滤波器尽可能靠近天线或发射/接收端口放置，以缩短未屏蔽引线长度；
- 保持输入/输出侧阻抗连续，使用 50Ω 微带或带状线连接；
- 周围地平面完整，并在滤波器附近布置足够地孔以保证良好接地与屏蔽；
- 在高功率发射路径上注意滤波器功率额定（如需更高功率，应确认器件规格或选用专用型号）；
- 采用兼容 SMT 的回流焊工艺，推荐在实际工艺条件下验证焊接可靠性。
六、可靠性与环境适应
本器件适用于工业温度范围内工作，设计上考虑到典型射频设备长期稳定性。建议在极端温度循环、振动或湿度环境下进行系统级验证以满足最终产品的可靠性要求。
七、采购与使用注意
- 选型时确认频段与目标系统的带宽匹配；
- 关注产器件批次一致性，必要时索取详细的 S 参数与封装图纸进行仿真与尺寸验证；
- 在样机阶段进行实际板级射频测量（S11、S21）以确认性能符合系统要求。
如需器件 S 参数文件、封装尺寸图或样品信息，可联系供应商或 TDK 技术支持获取进一步资料。
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