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TDK MPZ1608S471ATD25
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MPZ1608S471ATD25
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MPZ1608S471ATD25
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0228288756
- Operating Temperature
- 55℃~+125℃
- Current
- 1A
- @Frequency
- 470Ω@100MHz
- Resistor(DCR)
- 150mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MPZ1608S471ATD25 产品概述
一号 概述
TDK MPZ1608S471ATD25 是一款表面贴装型磁珠（ferrite bead），封装为 0603（1608 公制），用于高频干扰抑制和电磁兼容（EMC）处理。该元件在 100MHz 时阻抗为 470Ω，直流电阻（DCR）仅 150mΩ，额定电流 1A，允许工作温度范围为 -55℃ 至 +125℃，单通道结构，适合于空间受限的消费电子与工业设备电路中对高频噪声的抑制。
二号 主要参数
- 阻抗：470Ω @ 100MHz（典型值）
- 阻抗误差：±25%
- 直流电阻（DCR）：150mΩ
- 额定电流：1A（连续）
- 通道数：1
- 工作温度：-55℃ ~ +125℃
- 封装：0603（公制 1608）
- 品牌：TDK
三号 特性与优势
- 高频抑制能力强：在 VHF/UHF 频段（尤其是 100MHz 附近）具有显著阻抗值，可有效吸收和衰减高频干扰。
- 低压降：150mΩ 的低 DCR 可减小在电源线或信号线上的直流压降，适合对电压敏感的电路。
- 小型化：0603 封装便于高密度 PCB 布局，适合便携和紧凑型设备。
- 宽温度范围：-55℃ 至 +125℃ 满足多种环境使用需求。
四号 典型应用
- 电源线输入/输出的 EMI 抑制与滤波。
- USB、HDMI、LVDS 等高速接口的差模/共模噪声抑制。
- 无线通讯（Wi‑Fi/BT/蜂窝）射频前端及模块供电干扰控制。
- 工业控制、测量仪器及消费电子的 EMI 合规设计。
五号 选型与注意事项
- 注意直流偏置效应：磁珠的高频阻抗随直流电流和频率可能下降，建议在实际工作频率和电流条件下验证阻抗曲线。
- 电流裕度：额定 1A 为连续最大值，若有脉冲电流或热聚集，应考虑余量或并联/更高规格器件。
- 与旁路电容配合：常与电容组成 LC/π 型滤波网络以优化低频至高频的整体抑制性能。
- 阻抗容差 ±25%，在严苛滤波设计中请考虑容差带来的影响并做好仿真验证。
六号 装配与可靠性
- 推荐按照 TDK 或通用 SMD 回流焊工艺进行焊接，遵循 PCB 焊盘设计和回流温度曲线。
- 机械应力敏感，贴装和后续加工应避免过度弯折和冲击。
- 关注长期热耗散：在接近额定电流工作时，应评估温升对性能和可靠性的影响。
- 常规清洗与化学品兼容性需参考厂商资料，避免影响外观或电气特性。
总结：MPZ1608S471ATD25 以其在 100MHz 附近的高阻抗、低 DCR 和小尺寸封装，适用于对高频噪声抑制有严格要求且空间受限的设计。选型时应结合实际电流、频谱分布及系统热设计进行验证，以达到最佳 EMC 效果。
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