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TDK C1005X7R1C103KT000F
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- TDK C1005X7R1C103KT000F
- Type
- TDK
- Minimum package
- 10000
Technical parameters
- Electronic Component
- TDK
- Electronic Component
- C1005X7R1C103KT000F
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0257285758
- Electronic Component
- X7R
- Voltage
- 16V
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1005X7R1C103KT000F 产品概述
一、产品简介
C1005X7R1C103KT000F 为 TDK 生产的一款多层陶瓷贴片电容（MLCC），封装为 0402（公制尺寸 1005）。标称容量为 10 nF（103），初始精度 ±10%，额定电压 16 V，介质类型为 X7R。该型号属于通用型陶瓷电容，具有体积小、耐温性能良好和与表面贴装工艺高度兼容的特点，广泛用于移动设备、消费电子与电源旁路等场合。
二、主要规格与电气性能
- 容值：10 nF（标称）
- 精度：±10%（常温标称）
- 额定电压：16 V DC
- 介质：X7R（温度特性符合 -55 °C 至 +125 °C 范围内容值变化在 ±15% 之内）
- 封装：0402（1005）
- 特性：低等效串联电阻（ESR）与低等效串联电感（ESL），适合高频旁路/去耦 说明：X7R 为介电常数较高的陶瓷体系，具备体积与容量间的折中，但在温度、偏压下容值会发生变化；设计时应考虑工作电压下的直流偏置效应及温度漂移。
三、封装与工艺兼容性
该元件为 0402 超小型贴片，适配自动贴装与无铅回流焊工艺。推荐采用合适的焊盘尺寸和助焊膏印刷量以保证焊点可靠性；回流焊温度曲线应符合器件制造商的工艺指南。小封装对回流热应力及焊接机械应力较敏感，贴装及波峰/返修时需注意避免过度机械应力。
四、典型应用场景
- 电源去耦与旁路：靠近芯片电源引脚抑制高频噪声
- 滤波网络与交流耦合：与电感/电阻组成 RC / LC 滤波器
- 基本耦合/退耦用途：音频、信号链路的阻抗匹配与去耦
- 消费电子、可穿戴、移动通信、物联网终端等体积受限场合
五、选型与使用建议
- 若电路对温漂与精度要求很高（如高精度时基或滤波），建议选用 C0G/NP0 型陶瓷；X7R 更适合旁路/去耦与一般滤波。
- 考虑直流偏置：在 16 V 或接近工作电压时，实际有效电容会下降，设计时应以工作电压下的有效电容为依据，必要时使用额定电压更高或更大标称容量的器件。
- 封装与可靠性：0402 体积小，对机械应力敏感。板上孔位布局、焊盘设计与波峰返修工艺需合理规划，避免器件裂纹。
- 温度与老化：X7R 存在随温度变化的容量漂移，长期使用需考虑老化效应。
六、储存与可靠性注意事项
- 储存环境避免高湿、高温与强酸碱气体，建议按厂家建议的干燥包装条件存放并在规定期限内使用。
- 贴装前若包装开封，必要时进行烘干以防潮气导致焊接缺陷或裂纹。
- 在产品检验与工程验证阶段，进行实测的容值-电压特性曲线和回流耐受性测试，以确认满足具体应用需求。
总结：C1005X7R1C103KT000F 为一款适用于空间受限场合的通用 X7R MLCC，适合电源去耦与一般滤波应用。选型时需兼顾直流偏置、温漂与封装可靠性，按实际工作条件验证其有效电容与可靠性表现。
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