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TDK MLG1005S3N9BTD25
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLG1005S3N9BTD25
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S3N9BTD25
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 3.9nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0257285060
- Electronic Component
- AEC-Q200
- Current
- 700mA
- Frequency
- 5GHz
- Resistor(DCR)
- 110mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S3N9BTD25 产品概述
一、概述与主要参数
MLG1005S3N9BTD25 是 TDK 推出的车规级叠层贴片电感，封装为 0402（1005 公制），主要参数如下：
- 感值：3.9 nH
- 额定电流：700 mA
- 直流电阻（DCR）：110 mΩ
- 品质因数：Q = 8（@100 MHz）
- 自谐振频率（SRF）：约 5 GHz
- 车规认证：AEC-Q200
- 类型：叠层电感（MLG 系列）
二、产品特点
- 小尺寸高密度：0402 封装适合空间受限的移动、车载与便携设备。
- 高频特性良好：SRF ≈ 5 GHz，适用于微波及高速信号链路中的阻抗匹配和小电感量需求。
- 车规可靠性：通过 AEC-Q200 认证，适配汽车电子对温度、振动和湿度的更高要求。
- 稳定性与一致性：叠层结构带来较好的批次一致性与温漂控制，适合批量生产应用。
三、典型应用场景
- 高频阻抗匹配与滤波：射频前端、天线匹配网络、带通/带阻滤波器的一部分。
- EMI 抑制与去耦：高速接口（如 USB/PCIe/SerDes）的小电感串联阻抗控制或滤波。
- 汽车通信与雷达子系统：基于其车规等级，可用于车载以太网、CAN 收发器周边的滤波与阻抗调整。
- 高频模拟/数字电路中的阻抗调整元件。
四、使用与布局建议
- 布局：0402 尺寸对焊盘尺寸与焊接工艺敏感，建议参考 TDK 数据表的推荐焊盘尺寸与焊膏覆盖率，避免过大或过小焊盘引起可靠性问题。
- 电流与温升：额定电流 700 mA 为温升限制下的允许值，长期工作时需考虑在工作环境温度下的导通损耗与升温，必要时进行热仿真或实际测温验证。
- 高频性能注意：接近或超过 SRF 时电感表现转为容性，应避免在高于 5 GHz 的工作频段中作为感性元件使用。Q 值为 8@100MHz，说明在 100 MHz 附近存在一定损耗，设计时需考虑插入损耗影响。
- 焊接工艺：遵循制造商推荐的回流焊曲线，避免重复高温循环造成可靠性降低。
五、可靠性与选型注意
- 若系统对 DCR 有更严格要求或需更高电流能力，可考虑更大封装或低 DCR 型号；反之若需更高 Q 或更大感值，应选择相应系列替代件。
- 在车规或工业级应用中，建议与供应商确认具体的批次测试报告与额外环境应力测试数据，以满足最终产品认证需求。
总结：MLG1005S3N9BTD25 以其小尺寸、车规认证和 GHz 级 SRF，非常适合空间受限且要求高可靠性的高频及汽车电子应用。在实际设计中，请结合数据手册中的电气/机械图与推荐焊接布局，完成温升与频域特性的验证。
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