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TDK MLG1005S5N1ST000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S5N1ST000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S5N1ST000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 5.1nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0262574985
- Current
- 600mA
- Frequency
- 4GHz
- Resistor(DCR)
- 130mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S5N1ST000 产品概述
一、规格概述
MLG1005S5N1ST000 为 TDK 系列 0402（公制 1005）叠层贴片电感，标称电感值 5.1 nH，额定直流电流 600 mA，直流电阻（DCR）约 130 mΩ，品质因数 Q=8（@100 MHz），自谐振频率（SRF）约 4 GHz。该器件适用于高频、空间受限的表面贴装设计。
二、主要特性
- 小体积（0402 / 1005），便于高密度 PCB 布局与微型化产品应用。
- 低电感值、较高自谐频率，适合 RF 匹配、去耦与高频滤波。
- 中等 Q 值（100 MHz 时约 8），在射频前端和滤波网络中表现稳定。
- 额定电流 600 mA，适用于中低电流路径的去耦及偏置电感。
三、典型应用场景
- 无线通信射频（RF）匹配网络与阻抗调节。
- 高频去耦与旁路，尤其在天线或 LNA 附近的滤波／阻断直流路径。
- EMI 抑制、信号线损耗控制和小信号偏置电感。
- 移动设备、蓝牙、Wi‑Fi、GPS 等空间受限的消费电子产品。
四、设计与使用建议
- 布局时尽量缩短信号走线，避免引入过多寄生电感与电容。0402 尺寸要求精确贴装与回流工艺。
- 考虑电流引起的温升与电感值因直流偏置可能的下降，设计时应预留裕量。
- 高频测量需使用合适夹具与网络分析仪，注意夹具和焊盘寄生导致的测量误差。
- 自谐振频率约 4 GHz，工作频率接近 SRF 时电感行为会显著变化，应避免在 SRF 附近作为理想电感使用。
五、封装与可靠性
- 封装：0402（1005 公制），适合自动贴装与回流焊工艺。
- 包装：标准卷带（详细包装数量与方式请参照 TDK 规格书）。
- 材料与工艺符合常见电子产品可靠性规范，建议按厂商回流曲线与抗机械冲击要求处理。
六、选型与替代方案
- 若需更低 DCR 或更高电流能力，可考虑更大封装或专用功率电感。
- 若工作频率高于 SRF，宜选用自谐频率更高或专为 GHz 频段设计的器件。
- 最终选型请结合 PCB 空间、热管理、电流与频率需求，并参照 TDK 官方规格书的完整电气与环境参数。
注：以上信息为产品概述与使用建议，具体电气特性、封装尺寸、公差与回流工艺参数请以 TDK 正式规格书与应用说明书为准。
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