Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MLG1005S27NHT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S27NHT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S27NHT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.012g
- Inductor
- 27nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0264866614
- Current
- 300mA
- Frequency
- 1.6GHz
- Resistor(DCR)
- 530mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S27NHT000 产品概述
MLG1005S27NHT000 是 TDK 面向高频小型化应用推出的一款贴片电感，采用 0402（公制 1005）超小封装，电感值 27 nH，公差 ±3%。该器件结合小体积和良好的高频特性，适用于对尺寸和寄生参数有严格要求的射频、信号链和滤波场合。
一、主要参数概览
- 品牌：TDK
- 型号：MLG1005S27NHT000
- 封装：0402（1005 公制）贴片
- 电感值：27 nH，精度 ±3%
- 额定直流电流：300 mA
- 直流电阻（DCR）：约 530 mΩ
- 品质因数（Q）：8（@100 MHz）
- 自谐振频率（SRF）：约 1.6 GHz
二、产品特点与性能分析
- 小型化封装：0402 尺寸可显著节省 PCB 空间，利于手机、可穿戴设备和无线模组等小型化设计。
- 高频性能：SRF ≈1.6 GHz，适用于低至中高频段的射频匹配、谐振和阻抗网络。Q=8@100MHz 表明在中频段具有中等选择性。
- 电流与损耗权衡：DCR 较大（≈530 mΩ）且额定电流为 300 mA，因此更适合用于信号链或小电流滤波，而非高电流电源滤波场景。
三、典型应用场景
- 射频匹配网络与调谐电路（天线匹配、滤波器）
- 高频信号滤波（去耦、带阻/带通组合）
- 射频前端与收发器模块中需要小感值、低体积元件的位置
- 高频振荡器或谐振回路（需注意功率和电阻限制）
四、封装与安装建议
- 推荐采用贴片回流焊工艺安装，注意按照制造商提供的回流焊温度曲线进行，以避免封装或性能受损。
- 布局建议：电感与相邻器件空间尽量留小，以降低引线和过孔引入的寄生；走线尽量短且宽度适中，避免增加额外串联电阻与寄生电感。
- 由于为 0402 超小封装，贴装、回流及波峰焊作业需使用精密贴装设备及适当的焊膏量，防止偏位或焊接缺陷。
五、注意事项与可靠性
- 适用电流限制（300 mA）意味着在实际设计中需避免长期过载，以免导致温升及参数漂移。
- 高 DCR 值对小信号路径影响有限，但在需要低损耗或高效率的功率路径上需慎重选用。
- 频率使用时应注意接近或超过 SRF 时器件会出现容性行为，设计时参考完整的频率响应曲线。
- 推荐在最终设计前参考 TDK 官方数据手册获取完整的温度特性、机械规格、回流曲线和可靠性测试数据。
结论：MLG1005S27NHT000 提供了在极小封装下实现 27 nH 电感的解决方案，适合紧凑型射频与滤波应用。若设计中对损耗、额定电流或更高频特性有更严格要求，建议对比其他封装或更低 DCR 的型号，并参照 TDK 数据手册做详细验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
