Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK 公司的 MLG1005S0N6CT000 是一款高性能的贴片电感,采用0402(1005公制)封装。这款多层陶瓷电感具有极低的电感值(0.6nH)和优异的自谐振频率(10GHz),非常适合高频应用和信号完整性要求高的电子电路。该型号不仅展现出出色的电流承载能力(1A),而且其整体设计使其在-55°C到125°C的工作温度范围内保持高效和稳定的性能。
电感值:0.6nH
自谐振频率:10GHz
额定电流:1A
DC电阻(DCR):最大100毫欧
工作温度范围:-55°C ~ 125°C
封装尺寸:0402(1005公制)
安装类型:表面贴装
TDK MLG1005S0N6CT000 在多个领域中有广泛的应用,尤其是在高频和高性能要求的电子设备中,例如:
TDK 作为行业领先的电子元器件制造商,以其出色的品质和技术实力在市场上享有很高声誉。MLG1005S0N6CT000 的这一特性组合,使其在竞争中具备了明显的优势。其超低电感值和高自谐振频率的设计,不仅能够满足业界对电感的基本性能要求,还在信号传递的有效性和稳定性上,远超同类产品,吸引了众多专业用户的青睐。
TDK MLG1005S0N6CT000 贴片电感以其优秀的技术参数和可靠的性能,为高频和高效能的电路设计提供了极佳的解决方案。它的应用范围广泛,特别适合对信号完整性和效能有严苛要求的现代电子设备。选择 MLG1005S0N6CT000,意味着选择了一款在高技术环境下依然能够发挥稳定性能的电感器件,从而为您提升产品的整体竞争力和市场占有率。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products