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TDK MMZ1005Y471CT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MMZ1005Y471CT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MMZ1005Y471CT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0263578487
- Operating Temperature
- 55℃~+125℃
- Current
- 250mA
- @Frequency
- 470Ω@100MHz
- Resistor(DCR)
- 470mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMZ1005Y471CT000 产品概述
一、主要参数与型号说明
MMZ1005Y471CT000 为 TDK 一款贴片磁珠（ferrite bead），封装尺寸 0402（1005 公制），型号中的“471”表明在 100 MHz 时名义阻抗为 470 Ω。主要电气参数如下：阻抗 Z = 470 Ω @ 100 MHz；允许误差 ±25%；直流电阻 DCR = 470 mΩ；额定直流电流（最大通过电流）250 mA；通道数 1；工作温度范围 -55 ℃ 至 +125 ℃。
二、性能特性
- 高频抑制能力强：在 VHF/UHF 频段（以 100 MHz 为参考）提供较高阻抗，有效衰减高速信号及开关电源产生的共模/差模噪声。
- 低直流电阻：DCR 仅 470 mΩ，能够在保证抑制效果的同时减小功率损耗与压降，适合中低电流的电源滤波场合。
- 宽温度范围：-55 ℃ 至 +125 ℃，适应较严苛的工作环境。
- 小型化封装：0402 封装便于高密度 PCB 布局，适用于移动设备与便携电子产品。
三、典型应用场景
- 便携式终端与无线通信设备的电源线和信号线 EMI 抑制；
- MCU/ASIC 供电分支的去耦与射频干扰隔离；
- USB、HDMI、摄像头模组等高速接口的共模/差模噪声控制；
- 工业与消费类电子中对体积与滤波性能有平衡需求的场合。
四、PCB 布局与使用建议
- 尽量将磁珠放置在噪声源与受敏感电路之间，靠近噪声源侧布置以提高衰减效果；
- 串联使用时应保证走线最短、焊盘阻抗一致，避免形成不必要辐射回路；
- 若电路有较大直流通过量或瞬态电流，需评估压降与发热，避免持续接近或超过额定电流；
- 注意磁珠阻抗随频率与直流偏置而变化，实际滤波效果应通过仿真与实验验证。
五、可靠性与合规
本器件符合常见电子制造工艺的回流焊温度要求（具体焊接曲线请参照 TDK 数据手册），材料与制造工艺满足常见环保法规（请以最新数据手册为准）。日常选型时建议参考官方数据手册的频率响应曲线、功率等级与封装机械图，以确保满足系统长期可靠性要求。
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