Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MLZ2012A3R3WT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLZ2012A3R3WT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLZ2012A3R3WT000
- Electronic Component
- 1
- Package
- 0805
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.042g
- Inductor
- 3.3uH
- Electronic Component
- 1
- Electronic Component
- BM0058431470
- Current
- 450mA
- Frequency
- 90MHz
- Resistor(DCR)
- 340mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLZ2012A3R3WT000 产品概述
概要
MLZ2012A3R3WT000 是由知名电子元器件制造商 TDK 推出的一个高性能贴片电感器。该产品属于多层铁氧体磁芯系列，设计用于各种电子设备中的高频应用。
基础参数
- 类型: 多层铁氧体磁芯
- 电感: 3.3 µH
- 容差: ±20%
- 额定电流: 450 mA
- 饱和电流: 200 mA
- 屏蔽: 有屏蔽
- DC 电阻 (DCR): 340 毫欧
- 自谐振频率: 90 MHz
- 工作温度范围: -55°C ~ 125°C
- 测试频率: 10 MHz
封装和尺寸
- 安装类型: 表面贴装型 (SMD)
- 封装/外壳: 0805 (2012 公制)
- 大小/尺寸: 0.079" 长 x 0.049" 宽 (2.00 mm x 1.25 mm)
- 安装高度（最大值）: 0.041" (1.05 mm)
应用场景
MLZ2012A3R3WT000 适用于各种需要高频滤波、储能和信号处理的电子设备。以下是一些典型的应用场景：
高频滤波器:
- 由于其高自谐振频率（90 MHz）和低DCR（340 毫欧），该电感器非常适合用于高频信号的滤波和隔离。
DC-DC 转换器:
- 在DC-DC 转换器中，MLZ2012A3R3WT000 可以作为储能元件，帮助实现高效的能量转换。
无线通信设备:
- 该电感器的高频特性使其成为无线通信设备（如手机、无线路由器等）中的理想选择，用于信号处理和滤波。
工业控制系统:
- 在工业控制系统中，MLZ2012A3R3WT000 可以用于信号调节、滤波和能量储存。
消费电子产品:
- 该产品也广泛应用于消费电子产品，如笔记本电脑、平板电脑和智能家居设备等，用于提高系统的稳定性和性能。
特点和优势
- 高频性能: 90 MHz 的自谐振频率使得该电感器在高频应用中表现出色。
- 低DCR: 340 毫欧的DCR有助于减少能量损耗，提高系统效率。
- 宽工作温度范围: -55°C ~ 125°C 的工作温度范围使得该产品能够在各种环境条件下稳定运行。
- 小尺寸: 0805 封装使得该产品非常适合紧凑的 PCB 设计。
- 屏蔽设计: 有屏蔽的设计可以有效减少电磁干扰，提高系统的整体性能。
安装和使用注意事项
- 焊接: 请按照供应商提供的焊接指南进行安装，以确保最佳的连接质量和可靠性。
- 布局: 在 PCB 布局中，应尽量避免将该电感器放在高温区域或高频干扰源附近。
- 测试: 在使用前，建议进行初步测试以确保电感值和DCR符合预期。
总结
MLZ2012A3R3WT000 是一款高性能、多功能的贴片电感器，适用于广泛的电子设备和系统。其优异的高频特性、低DCR和宽工作温度范围，使其成为许多工程师和设计师的首选。通过选择此产品，您可以提高您的系统的稳定性、效率和整体性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
