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TDK MHQ1005P3N3BT000
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MHQ1005P3N3BT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MHQ1005P3N3BT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 3.3nH
- Electronic Component
- 1
- Factor
- 23@250MHz
- Electronic Component
- BM0254021893
- Current
- 900mA
- Frequency
- 6GHz
- Resistor(DCR)
- 60mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MHQ1005P3N3BT000 产品概述
一、产品简介
MHQ1005P3N3BT000 为 TDK 0402 封装的叠层贴片电感，标称电感值 3.3 nH。该器件体积微小，适合空间受限的高频电路与射频前端应用，结合叠层工艺在高频下仍能保持较好性能，便于表面贴装生产。
二、主要性能参数
- 电感值：3.3 nH
- 额定电流：900 mA
- 直流电阻（DCR）：60 mΩ
- 品质因数：Q = 23 @ 250 MHz
- 自谐振频率（SRF）：6 GHz
- 封装：0402（1005 公制）
- 类型：叠层电感（Multilayer）
在 250 MHz 时的感抗约为 XL = 2πfL ≈ 5.2 Ω，因此在该频段表现出较高的阻抗和良好 Q 值；在接近 SRF 时器件行为将由感性转为容性，需注意电路频率分布。
三、特点与优势
- 小型化：0402 封装适应高密度 PCB 布局。
- 高频性能良好：Q 值较高、SRF 达 6 GHz，可满足宽频带射频需求。
- 低 DCR：60 mΩ 降低直流功耗，有利于射频和滤波环节的损耗控制。
- 合理电流容量：900 mA 对于许多偏置网络和滤波器足够。
四、典型应用
- 射频匹配网络、谐振回路与调谐单元
- 高频滤波器、带阻/带通滤波器元件
- 偏置去耦、RF 偏置供给路径（bias-tee）
- 通信、无线模块、滤波与阻抗变换场合
五、选用与安装建议
- 若工作频率接近或超过 SRF，应验证实际电路中器件表现并考虑寄生电容影响。
- 关注额定电流与温升关系，必要时做热余量和电流退让设计。
- 推荐采用标准回流焊工艺，避免过度机械应力和超温；焊盘长度不宜过长，以减少寄生电感。
- 布线时靠近器件的地与电源回流路径应优化，减少环路面积以降低 EMI。
综合来看，MHQ1005P3N3BT000 在微型化与高频性能之间取得良好平衡，适用于对体积和射频指标有较高要求的现代无线电子设计。
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