WMSIC Electronic Components

TDK MLF1608E120JTD25

ModelMLF1608E120JTD25
Package0603
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MLF1608E120JTD25
Type
TDK
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLF1608E120JTD25
Electronic Component
1
Package
0603
Electronic Component
SMD Inductor
Electronic Component
±5%
Electronic Component
0.033g
Inductor
12uH
Electronic Component
1
Factor
30@2MHz
Electronic Component
BM0220889480
Electronic Component
AEC-Q200
Current
10mA
Frequency
25MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MLF1608E120JTD25 产品概述

MLF1608E120JTD25 是一款由知名品牌 TDK 生产的高性能贴片电感器,其在多层结构和先进的铁氧体材料的设计下,展现出优越的电气特性和热稳定性,适用于各种电子设备中的电感应用。以下是产品的具体参数和应用特点。

产品基础参数

  • 类型: 多层
  • 磁芯材料: 铁氧体
  • 电感值: 12µH
  • 容差: ±5%
  • 额定电流: 10mA
  • 屏蔽: 屏蔽设计
  • 最大直流电阻 (DCR): 1.8Ω
  • Q 值: 30 @ 2MHz
  • 自谐振频率: 25MHz
  • 等级: AEC-Q200 认证(适合汽车行业标准)
  • 工作温度范围: -55°C 到 125°C
  • 电感频率 - 测试: 2MHz
  • 安装类型: 表面贴装型(SMD)
  • 封装/外壳: 0603(1608 公制)
  • 器件尺寸: 1.60mm x 0.80mm
  • 最大高度: 0.95mm

技术优势

  1. 高性能电感: MLF1608E120JTD25 提供 12µH 的电感值,适合用于高频和低频应用场合。此设计能够在 2MHz 的频率下,实现优越的 Q 值,确保信号处理过程中最小的能量损耗。

  2. 高自谐振频率: 自谐振频率高达 25MHz,保证了其在无线通信、射频(RF)电路中的可靠性与稳定性,适用于高频信号的过滤和调制。

  3. 抗环境因素: 该元件的工作温度范围达到 -55°C 到 125°C,能够在极端环境中稳定工作,符合AEC-Q200标准,具备良好的汽车电子产品兼容性。

  4. 低直流电阻: 最大 DCR 值为 1.8Ω,确保电流流动的高效性,减少系统能耗。

  5. 小巧封装: 封装尺寸为 0603(1608公制),非常适合空间有限的电子设备,如智能手机、平板电脑及其他便携式设备,使得安装更加灵活简便。

  6. 优异的屏蔽性能: 采用屏蔽设计,有效减小电磁干扰,保证产品在复杂电磁环境中的正常性能,提升了设备整体的稳定性。

应用领域

MLF1608E120JTD25 适用于多个高性能电气领域,包括但不限于:

  • 消费电子: 智能手机、平板电脑和可穿戴设备中的高频电路。
  • 汽车电子: 由于其符合AEC-Q200标准,适合用于车载音响、导航系统及其他电子控制模块。
  • 无线通信: 在射频模块和基站设备中,用于信号滤波和调谐。
  • 工业控制设备: 适合于工控设备中用于信号稳压和滤波的应用。

总结

MLF1608E120JTD25 是一款集高性能、优良热稳定性和小巧表面贴装设计优势于一体的贴片电感器。无论是在消费电子、汽车电子,还是无线通信等领域,它都展现出极高的应用价值和可靠性。凭借 TDK 的技术积累和品牌信誉,该产品将是广大电子工程师进行电路设计时的优选解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.