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TDK MLF1005VR56JT000
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLF1005VR56JT000
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLF1005VR56JT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Inductor
- 560nH
- Electronic Component
- 1
- Factor
- 15@25MHz
- Electronic Component
- BM0254021903
- Current
- 120mA
- Frequency
- 170MHz
- Resistor(DCR)
- 1.35Ω
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK MLF1005VR56JT000 产品概述
一、产品概况
MLF1005VR56JT000 是 TDK 推出的屏蔽型叠层电感器，封装为 0402（1005 公制），额定电感值为 560 nH，公差 ±5%。该器件采用多层陶瓷绕制并封装为屏蔽结构，适合在空间受限的表面贴装电路中用于滤波、阻抗匹配与谐振等应用。
二、主要技术参数
- 电感值：560 nH，公差 ±5%
- 额定电流：120 mA（持续直流电流）
- 直流电阻（DCR）：典型 1.35 Ω，最大 1.95 Ω
- 品质因数（Q）：15 (@ 25 MHz)
- 自谐振频率（SRF）：约 170 MHz
- 类型：叠层（多层）屏蔽电感
- 封装：0402（1005 公制）表面贴装
三、性能特点
- 小型化封装：0402 规格适用于高密度 PCB 布局，节省电路板空间。
- 屏蔽结构：抑制磁场外泄，减少对邻近敏感器件的干扰，有利于密集布线环境。
- 高频性能良好：Q 值在 25 MHz 附近能保持较好性能，自谐振频率约 170 MHz，对于中高频滤波与阻抗控制有效。
- 受控电流能力：120 mA 额定电流适合小信号和偏置电流较低的应用场景。
- 稳定性：叠层结构在温度与机械应力下表现出较好的电感稳定性，适合常规 SMT 工艺。
四、典型应用场景
- 高频滤波与去耦（例如通信前端、射频模块的 EMI 抑制）
- 匹配网络与阻抗调节（天线匹配、滤波器单元）
- 信号链中的旁路、电感插入元件（尤其是在空间受限的移动设备、蓝牙/ WLAN 模块）
- 精密测量与传感电路中用于控制带宽或抑制干扰的元件
五、布局与使用建议
- 预留焊盘：遵循 0402 的标准焊盘尺寸与过孔策略，保证良好焊接与可重复性。
- 附近走线：尽量避免在电感周围放置敏感模拟输入或高阻抗节点，以减少耦合干扰。
- 直流偏置影响：在实际电路中，直流偏置电流会使电感量下降，应在选型时预留裕量或进行仿真/测量验证。
- 温升与散热：高 DCR 会带来一定的功耗，在连续通过大电流时需关注温度升高对电感与周边器件的影响。
- 焊接工艺：兼容常见的 SMT 回流焊工艺，建议依据 PCB 装配厂的回流曲线进行工艺确认。
六、选型与注意事项
- 若电路需通过更大电流或更低 DCR，请考虑更大封装或专用电感系列。
- 对于工作频率接近或超过 SRF（170 MHz） 的应用，应验证器件在目标频段的等效阻抗特性。
- 在可靠性或极端环境（高温、高湿）应用中，建议与 TDK 或分销商确认器件的环境规格与失效模式。
- DCR 的典型值与最大值并存于不同工况下，设计时应以最大 DCR 和实际温度条件评估功耗。
七、封装与采购信息
型号：MLF1005VR56JT000，品牌：TDK，标准 0402 表面贴装封装，适合自动贴装与回流焊流程。采购时建议索取完整数据手册以获取更详尽的频率响应、温度特性、机械尺寸和可靠性资料。
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