WMSIC Electronic Components

TDK MMZ1608D121CTAH0

ModelMMZ1608D121CTAH0
Package0603
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MMZ1608D121CTAH0
Type
TDK
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MMZ1608D121CTAH0
Electronic Component
1
Package
0603
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.033g
Electronic Component
1
Channel Count
1
Electronic Component
BM0254006320
Operating Temperature
55℃~+125℃
Current
400mA
@Frequency
120Ω@100MHz
Resistor(DCR)
300mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMZ1608D121CTAH0 产品概述

一、产品简介

MMZ1608D121CTAH0 是 TDK 出品的一款 0603 封装磁珠,用于高频噪声抑制与电源/信号线滤波。该器件在 100MHz 时阻抗为 120Ω,阻抗公差 ±25%,直流电阻(DCR)为 300mΩ,额定电流 400mA,单通道设计,工作温度范围 -55℃ 至 +125℃。体积小、适配表面贴装工艺,适合移动设备、消费电子与通信类小型化电路板的 EMI 抑制需求。

二、主要电气参数

  • 阻抗:120Ω @ 100MHz(典型值)
  • 阻抗容差:±25%
  • 直流电阻(DCR):300mΩ
  • 额定通过电流:400mA
  • 通道数:1(单端)
  • 工作温度:-55℃ ~ +125℃
  • 封装:0603(1608 公制尺寸)

三、性能特点

  • 高频抑制:在 VHF/UHF 频段具有较高阻抗,可有效衰减 EMI/射频干扰。
  • 体积小:0603 封装有利于高密度 PCB 设计与产品小型化。
  • 单通道结构:适用于单线电源或信号线的噪声抑制与去耦前级滤波。
  • 宽温工作:适应工业级温度范围,适合室温及较苛刻环境应用。

四、典型应用场景

  • 电源线滤波(DC-DC 模块输入/输出、LDO 供电)
  • 信号线抑制(USB、I2C、SPI 等高速信号线的高频噪声抑制,应注意信号完整性)
  • 手机、平板、可穿戴、IoT 终端等对尺寸与 EMI 要求高的产品
  • 通信设备、基站前端的射频干扰抑制次级方案

五、封装与安装建议

  • 封装为 0603,建议按照制造商或行业常规设计 PCB 焊盘并留有热膨胀余量,保证回流焊可靠性。
  • 焊接工艺建议采用标准无铅回流曲线控制峰值温度与时间,避免过高温度对磁性材料性能的影响。
  • 对于高电流或长时间工作场景,建议留有电流余量,避免长期在额定电流附近工作导致升温、阻抗变化或寿命下降。

六、使用注意事项

  • 阻抗随频率变化显著,选型时应参考频谱上关键干扰频段的阻抗曲线,而非仅参考单点(100MHz)值。
  • 直流电流经过时可能引起器件微弱发热与阻抗下降,设计中应考虑 DC 偏置对滤波效果的影响。
  • 对高速差分或高速串行信号应评估磁珠引入的串联阻抗对信号完整性的影响,必要时使用有针对性的 EMI 滤波方案。

七、可靠性与替代选型

  • 工作温度与额定电流条件下,遵循 TDK 的存储与使用建议可确保长期可靠性。
  • 需替代时,可选择参数接近(阻抗、DCR、封装与额定电流相近)的同规格磁珠,但应比对阻抗-频率特性曲线与温升/电流特性,保证性能匹配。

如需更详细的阻抗频率曲线、封装尺寸图或回流焊建议曲线,可参考 TDK 官方数据手册或提供具体工作频段与 PCB 应用场景,我可协助进一步选择与布局建议。

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