WMSIC Electronic Components

TDK C4532X7R1E226MT000N

TDK C4532X7R1E226MT000N
1 / 2

Product image

ModelC4532X7R1E226MT000N
Package1812
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

18 specifications

Core information

Product name
TDK C4532X7R1E226MT000N
Type
TDK
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
C4532X7R1E226MT000N
Electronic Component
1
Electronic Component
22uF
Package
1812
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.302g
Electronic Component
1
Electronic Component
BM0084284298
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：C4532X7R1E226MT000N

一、基本信息

C4532X7R1E226MT000N 是由知名电子元器件制造商 TDK 生产的一款贴片电容器，属于多层陶瓷电容器(MLCC)。其额定电压为25V，容量为22μF，符合X7R温度特性，封装尺寸为1812（即4.5mm × 3.2mm）。该产品以其优越的电气性能和可靠的热稳定性广泛应用于现代电子电路中。

二、主要特性

  1. 电容值与公差:

    • 电容值: 22μF，面向需要高电容值的应用场合，为电源去耦、滤波和储能等功能提供了理想的解决方案。
    • 公差: ±20%，确保在工作的电压和环境条件下电容值的稳定性，满足多种设计需求。

  2. 额定电压:

    • 该器件的额定电压为25V，适用于多种低压和中压电源管理应用，能够承受短时间的过压情况，增加系统的可靠性。

  3. 温度特性:

    • X7R 材料使得该电容在-55℃至+125℃的宽温度范围内保持相对稳定的电容量，特别适合于对温度敏感的应用环境，确保电路在极端条件下的稳定性和可靠性。

  4. 封装类型:

    • 1812 封装具有足够的表面积，能够有效地处理热量，适合SMT（表面贴装技术）生产，便于自动化焊接，并且在空间有限的设计中仍能实现高性能。

三、应用领域

C4532X7R1E226MT000N 贴片电容器因其优良的电气特性，适用于多个领域，包括但不限于：

  1. 消费电子:

    • 广泛应用于手机、平板电脑、笔记本电脑等个人电子设备中，主要用于电源去耦和信号滤波，提高设备的稳定性和性能。

  2. 工业设备:

    • 在工业控制系统、自动化设备中，该电容器可用于电源管理和信号处理，确保系统在复杂环境下正常运行。

  3. 汽车电子:

    • 随着汽车电子化程度的提高，C4532X7R1E226MT000N也适用于汽车电源管理系统以及传感器和控制模块，增强系统的可靠性和耐用性。

  4. 通讯设备:

    • 在基站、路由器和其他通讯设备中，用于高频信号过滤和电流平滑，为高效的信号传输提供支持。

四、性能优势

  1. 高可靠性:

    • TDK 作为行业领先的电子元器件制造商，其产品质量控制达到国际标准，确保用户获得高可靠性的元件。

  2. 小型化与高灵活性:

    • 1812 封装允许设计师在空间紧凑的情况下集成更多功能，促进了设备小型化的发展趋势。

  3. 高频特性:

    • 适用于高频应用的设计，提供良好的阻抗特性，有助于提高系统性能。

五、总结

综上所述，C4532X7R1E226MT000N 是一款性能卓越、应用广泛的贴片电容器，尤其适合于对电容值和温度稳定性要求较高的电子设备设计。无论是在消费电子、工业设备，还是汽车电子和通讯领域，这款电容器都能提供可靠的性能支持，是现代电子设计中不可或缺的基础元件。选择 C4532X7R1E226MT000N，将为您的设计提供坚实的保障与支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.