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TDK MLG1005S0N4CT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S0N4CT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S0N4CT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 0.4nH
- Electronic Component
- 1
- Electronic Component
- BM0058427604
- Current
- 1A
- Frequency
- 10GHz
- Resistor(DCR)
- 100mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S0N4CT000 产品概述
一、产品简介
TDK MLG1005S0N4CT000 是一款0402（公制1005）封装的叠层贴片电感，额定电感值为 0.4 nH，设计用于高频电路中的阻抗匹配与滤波场合。该器件自谐振频率高达 10 GHz，能够在微波频段维持良好的电感特性，适合移动终端、射频前端与高速数字链路中的布局使用。
二、主要参数
- 品牌 / 型号：TDK MLG1005S0N4CT000
- 封装：0402 (1005) 叠层贴片电感
- 电感值：0.4 nH
- 额定电流：1 A
- 直流电阻 (DCR)：10 mΩ（典型，用户资料中亦有不同标注，请按厂家规格书为准）
- 自谐振频率（SRF）：10 GHz
- 类型：叠层电感
三、性能特点
- 极低电感值（0.4 nH）适合高频阻抗匹配与小量级偏置元件，不会在低频引入显著相位滞后。
- 高 SRF（≈10 GHz），在微波频段仍保持电感性，有利于射频链路设计。
- 低 DCR 与 1 A 的额定电流保证了在高频与直流叠加情况下的能量传输效率与热稳定性。
- 0402 超小封装，适合集成度高的消费电子产品与紧凑型射频模块。
四、典型应用
- 射频前端匹配网络（输入/输出匹配、电感补偿）
- 高速接口（差分对旁路、共模/差模匹配）
- 微波滤波器和谐振电路的微小电感元件
- EMI 抑制与短路径阻抗控制场合
五、选型与注意事项
- 注意电流与温升：尽管额定 1 A，但在高频连续功率下需留意温升与电感变化，重要场合参考实际温度特性曲线。
- 考虑电感公差与寄生电容：0.4 nH 属极低值，布局与周边走线寄生电感/电容会显著影响实际频率响应。
- 频率边界设计：器件在 SRF 附近会产生寄生行为，设计时应确保工作频率远离 SRF 或进行仿真验证。
- 可靠性与焊接：0402 封装尺寸很小，贴装与回流工艺需严格控制，以免产生开路或位移。
六、封装与焊接建议
- 推荐短引线、最短回流路径以降低额外寄生。
- 使用与制造商一致的回流曲线，避免过冲和过长高温暴露；贴装时注意静电防护与精密取放工具。
- 在板上留足铜箔面积作为散热路径，必要时配合热过孔设计以提高热耗散。
结论：MLG1005S0N4CT000 以其极低电感、低 DCR 与高 SRF 特性，适合高频精密匹配和微波应用，但在选型与布局时需充分考虑寄生影响与热管理，建议在实装后通过网络分析仪或仿真工具验证实际频率响应与匹配性能。
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