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TDK CGA2B2C0G1H270JT0Y0F
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK CGA2B2C0G1H270JT0Y0F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B2C0G1H270JT0Y0F
- Electronic Component
- 1
- Electronic Component
- 27pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0248738149
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK CGA2B2C0G1H270JT0Y0F 产品概述
一、产品简介
TDK 型号 CGA2B2C0G1H270JT0Y0F 为小尺寸多层陶瓷贴片电容（MLCC），标称容值 27 pF，公差 ±5%（J），额定电压 50 V，温度系数为 C0G（又称 NP0）。封装为 0402（约 1.0 mm × 0.5 mm），适合高密度贴片电路板与高可靠性电子设备使用。该系列以电容稳定性好、损耗低、频率特性优异为主要特点。
二、主要电气与物理特性
- 容值：27 pF，公差 ±5%（J 型号码 270J）。
- 额定电压：50 V，适用于一般模拟、射频与数字电路工作电压等级。
- 温度系数：C0G/NP0，温漂非常小，适合对频率稳定性和时间常数有严格要求的场合。
- 封装：0402（1005 公制），体积小、适合高密度贴装。
- 介质与性能：低介质损耗、低等效串联电阻（ESR）与低等效串联电感（ESL），高自谐频率，适合射频和高频通路使用。
三、典型应用场景
- 高频信号耦合、滤波与阻抗匹配（RF 前端、滤波网络、匹配网络）。
- 振荡器、时钟电路与频率确定网络（对温漂和稳定性要求高）。
- 高频旁路与去耦（在高频段对噪声抑制有效）。
- 精密模拟电路中的采样与定时元件（电容稳定性对电路性能至关重要）。
四、PCB 设计与焊接建议
- 贴片焊盘应参考 TDK 推荐的焊盘尺寸，保证良好焊接和可靠性；0402 要求控制焊盘与焊膏用量以避免立碑或偏位。
- 布局时尽量缩短信号路径与引线长度，靠近关键器件放置以降低串联电感与 EMI 敏感性。
- 使用共平面或连续接地面以改善高频返回路径与抑制干扰。
- 推荐采用无铅回流焊工艺，遵循元件制造商的温度曲线和最大回流温度。
五、可靠性与选型注意事项
- C0G（NP0）温度特性在宽温区间内保持稳定，常用于要求温漂极小的应用，但容值相对较小，不适合作为大幅度去耦电容替代。
- 0402 规格体积小，机械应力与处理损伤风险较高，贴装与储运过程中应注意防止过力挤压与跌落。
- 在高频设计中应关注自谐频率与寄生参数，必要时参考厂商提供的 S-参数或等效电路模型进行仿真。
- 选型时确认 PCB 走线、工作电压与环境温度范围，若用于汽车或高可靠性领域，请核实是否满足相应认证或额外测试要求。
六、采购与替代
- 型号编码中“270J”明确 27 pF ±5%，其他子码涉及封装系列和工艺信息。购买时建议向 TDK 授权经销商索取完整规格书、封装图与焊接推荐说明。
- 若需要同等电气性能的替代品，可选用同规格 C0G/NP0、0402、27 pF、50 V 的其它品牌 MLCC，但应对比等效串联电感、损耗以及制造商的可靠性数据。
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