WMSIC Electronic Components

TDK MLG0603P6N8HT000

ModelMLG0603P6N8HT000
PackageSMD
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MLG0603P6N8HT000
Type
TDK
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLG0603P6N8HT000
Electronic Component
1
Package
SMD
Electronic Component
SMD Inductor
Electronic Component
±3%
Electronic Component
0.009g
Inductor
6.8nH
Electronic Component
1
Factor
14@500MHz
Electronic Component
BM0265451449
Current
300mA
Frequency
4GHz
Resistor(DCR)
620mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MLG0603P6N8HT000 产品概述

概要

MLG0603P6N8HT000 是由 TDK 公司生产的高频多层陶瓷电感器,适用于各种高频电子设备中的滤波、耦合和能量存储应用。以下是对此产品的详细介绍。

基础参数

  • 类型: 多层陶瓷电感
  • 磁芯材料: 无磁性
  • 电感值: 6.8 nH
  • 容差: ±3%
  • 额定电流: 300 mA
  • 屏蔽: 无屏蔽
  • DC 电阻 (DCR): 750 毫欧(最大值)
  • Q 值: 14 @ 500 MHz
  • 自谐振频率: 4 GHz
  • 工作温度范围: -55°C ~ 125°C
  • 测试频率: 500 MHz

封装和尺寸

  • 安装类型: 表面贴装型(SMD)
  • 封装/外壳: 0201(0603 公制)
  • 大小/尺寸: 0.024" 长 x 0.012" 宽(0.60 mm x 0.30 mm)
  • 安装高度(最大值): 0.013"(0.33 mm)

特性和优势

高频性能

MLG0603P6N8HT000 具有优秀的高频性能,特别适用于 GHz 频段的应用。其 Q 值在 500 MHz 时达到 14,这意味着它在高频下具有较低的能量损耗和高效能量传输能力。

小尺寸设计

采用 0201(0603 公制)封装,使得该电感器非常适合现代电子设备中的空间有限场景。其小尺寸设计不仅节省了 PCB 布局空间,还有助于提高整体系统的集成度和可靠性。

宽工作温度范围

该电感器的工作温度范围从 -55°C 到 125°C,这使得它能够在各种极端环境下稳定运行,满足不同应用场景下的需求。

低 DCR

电感器的 DC 电阻(DCR)仅为 750 毫欧(最大值),这降低了在直流电流通过时产生的热量和能量损耗,提高了系统的总体效率。

高可靠性

TDK 公司以其高品质和可靠性的电子元器件而闻名。MLG0603P6N8HT000 通过严格的测试和验证,确保其在长期运行中保持稳定和可靠的性能。

应用场景

无线通信设备

由于其高频性能和小尺寸设计,MLG0603P6N8HT000 非常适合用于无线通信设备,如手机、无线路由器、蓝牙设备等。

高频滤波器

在高频信号处理中,需要高 Q 值和低 DCR 的电感器来实现高效能量传输和信号滤波。MLG0603P6N8HT000 是这种应用场景下的理想选择。

嵌入式系统

嵌入式系统通常要求元器件具有小尺寸、低功耗和高可靠性。MLG0603P6N8HT000 满足这些要求,适用于各种嵌入式应用,如工业控制系统、医疗设备等。

RF 模块

在 RF 模块中,高频电感器用于实现匹配网络、滤波器和耦合电路。MLG0603P6N8HT000 的高 Q 值和低 DCR 使其成为 RF 模块设计中的优选元器件。

总结

MLG0603P6N8HT000 是一款高性能、多层陶瓷电感器,专为高频应用而设计。其小尺寸、低 DCR、高 Q 值以及宽工作温度范围,使其成为现代电子设备中的理想选择。无论是在无线通信设备、嵌入式系统还是 RF 模块中,这款电感器都能提供稳定可靠的性能,满足各种高频电子应用的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.