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TDK MLG0603P4N7HT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG0603P4N7HT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603P4N7HT000
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.009g
- Inductor
- 4.7nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0058431611
- Current
- 350mA
- Frequency
- 5.5GHz
- Resistor(DCR)
- 160mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK MLG0603P4N7HT000 贴片电感产品概述
一、产品基本属性
- 品牌：TDK（东电化）
- 系列：MLG（多层陶瓷叠层贴片电感系列）
- 封装规格：0201英制（对应公制0603，尺寸约1.6mm×0.8mm）
- 核心定位：高频小信号贴片电感，专为小型化射频电路设计
二、核心电气参数详解
电感值与精度
标称电感值为4.7nH，精度±3%——满足射频电路对电感一致性的要求，可减少匹配调试工作量，避免因参数偏差导致的信号损耗。额定电流
直流额定电流为350mA——指电感在工作温度范围内，电感值变化不超过10%时允许的最大直流电流，适配小信号射频电路的电流需求（如蓝牙、WiFi模块的低功耗场景）。直流电阻（DCR）
直流电阻为160mΩ——低DCR设计可降低电流通过时的功率损耗，提升电路能效，减少发热。品质因数（Q值）
在500MHz频段下Q值为14——Q值越高，电感储能与损耗比值越大，意味着射频信号传输损耗更低，适合滤波、阻抗匹配等低损耗场景。自谐振频率（SRF）
自谐振频率为5.5GHz——高于常见射频应用频段（如2.4GHz、5GHz），可避免在工作频段内发生谐振，保证电路性能稳定（谐振时电感呈纯阻性，无法实现电感功能）。
三、关键性能优势
小型化适配
0201封装尺寸紧凑，可有效节省电路板空间，适配智能手机、无线耳机等便携设备的高密度布局需求。低损耗特性
低DCR（160mΩ）与高Q值（14@500MHz）结合，减少射频信号传输损耗，提升信号质量与传输效率。稳定可靠性
多层陶瓷叠层工艺确保电感性能稳定，在工作温度范围内参数漂移小，适合长期可靠运行的应用场景（如物联网节点的持续通信）。宽频段覆盖
5.5GHz自谐振频率覆盖主流射频频段（蓝牙2.4GHz、WiFi 5GHz、5G sub-6GHz），可满足多频段电路的设计需求。
四、典型应用场景
移动终端射频前端
智能手机、平板的WiFi（2.4GHz/5GHz）、蓝牙模块中的滤波、阻抗匹配网络。无线音频设备
TWS无线耳机、蓝牙音箱的射频电路匹配与滤波环节（降低信号干扰，提升音质）。物联网节点
智能家居传感器、可穿戴设备的射频通信模块（低功耗、小尺寸适配）。小型通信设备
便携式路由器、热点设备的射频前端电路设计（高Q值提升信号覆盖范围）。
五、选型参考要点
- 电感值匹配：需4.7nH电感且精度要求±3%的电路优先选择。
- 电流限制：应用电路直流工作电流不超过350mA，避免电感性能劣化。
- 频段适配：应用频段低于5.5GHz（如2.4GHz、5GHz），可充分利用高Q值特性。
- 封装需求：需0201小型化封装的高密度电路板设计场景。
该产品是TDK针对高频小信号电路推出的成熟方案，可满足便携设备、物联网等领域的射频设计需求，兼具小型化与高性能优势。
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