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TDK MLG0603PPA3N3CT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLG0603PPA3N3CT000
- Type
- TDK
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603PPA3N3CT000
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.009g
- Inductor
- 3.3nH
- Electronic Component
- 1
- Factor
- 10@500MHz
- Electronic Component
- BM0265150954
- Current
- 1.2A
- Frequency
- 4.5GHz
- Resistor(DCR)
- 70mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK MLG0603PPA3N3CT000 产品概述
一、概述与定位
MLG0603PPA3N3CT000 是 TDK 推出的屏蔽多层贴片电感，标称电感值 3.3 nH，封装为 0201（0603 公制）。该器件以小体积、高自谐振频率和适中的额定电流为特点，适合在高频射频匹配、滤波及去耦场景中替代传统较大封装的器件，满足空间受限且对高频性能有要求的应用。
二、主要电气参数
- 电感值：3.3 nH
- 额定电流（Ir）：1.2 A（热允许值，长期使用时应考虑温升）
- 直流电阻（DCR）：典型约 70 mΩ，规格上限 80 mΩ（注意焊盘与走线影响最终系统 DCR）
- 品质因数（Q）：10 @ 500 MHz（在 500 MHz 附近损耗特性可接受）
- 自谐振频率（SRF）：约 4.5 GHz（高频工作上限由此决定）
- 屏蔽结构：多层封闭磁场，减少对外部及外部对其的耦合
三、结构与封装优势
0201 超小封装（约 0.6 mm × 0.3 mm）节省 PCB 面积，采用多层陶瓷与屏蔽结构，磁通闭合，降低 EMI 散射与寄生耦合。适合高密度布局与多层板设计，同类场景下相比传统磁环或较大贴片电感能显著缩小占板面积。
四、典型应用场景
- 射频阻抗匹配元件（L 型匹配、偏置匹配）
- 高频去耦与滤波（尤其在子 GHz 至数 GHz 范围内）
- 射频收发模块、蓝牙/Wi‑Fi/ISM 子系统中的谐振与阻抗调节
- 低功耗、紧凑型移动设备与可穿戴终端的空间受限电感方案
五、布局与使用建议
- 布线尽量短且直，减少额外寄生电感与串联电阻。
- 在射频路径中靠近器件放置，避免在器件与负载之间放置多余焊点或过孔。
- 屏蔽结构对地面有更高敏感性，建议在靠近电感的区域维持连续平面或通过抑制共模回路的方式降低干扰。
- 焊接采用推荐回流曲线，注意 0201 尺寸对回流温度与湿度等级敏感，推荐精细贴装与良好焊盘设计。
六、测量与选型注意事项
- 高频特性需使用网络分析仪测量 S 参数，实际电感在高频因寄生电容而下降，SRF 以系统要求为准。
- 额定电流为热限制值，若在高温或脉冲大电流场景下工作，应确认电感值与 DCR 在工作点的变化。
- 若系统对 Q 值或损耗敏感，可在目标频率点进行实际测量并与仿真模型对比调整。
七、可靠性与存储
- 推荐按制造商推荐的包装与存储条件保存，防潮防尘，贴片器件在贴装前建议回烘以防潮气导致焊接缺陷。
- 在设计中考虑温度循环、震动与可能的过载条件，必要时与供应商确认加速寿命测试与温升数据。
总结：MLG0603PPA3N3CT000 以 3.3 nH、4.5 GHz SRF 与 0201 的超小体积，提供在高频应用中兼顾尺寸与性能的解决方案。根据实际频段、功率与布局限制进行测量验证与设计优化，可在射频模块与空间受限的电路中发挥良好效果。
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