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TDK MLG0603P22NHTD25
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG0603P22NHTD25
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603P22NHTD25
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.009g
- Inductor
- 22nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0262574048
- Electronic Component
- AEC-Q200
- Current
- 150mA
- Frequency
- 2.2GHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603P22NHTD25 产品概述
一、产品简介
MLG0603P22NHTD25 为 TDK 推出的高频贴片多层电感，标称电感值 22 nH，精度 ±3%，额定直流通过电流 150 mA，直流电阻（DCR）1.31 Ω，品质因数 Q = 14（测量点 500 MHz），自谐振频率（SRF）约 2.2 GHz。器件通过车规等级 AEC‑Q200 认证，适用于对可靠性要求较高的车载及工业电子系统。
二、主要电气参数
- 电感值：22 nH（±3%）
- 额定电流：150 mA（连续通电额定值，建议留有余量）
- 直流电阻（DCR）：1.31 Ω
- 品质因数：Q = 14 @ 500 MHz
- 自谐振频率：2.2 GHz
- 封装：0201 贴片（超小尺寸，适合高密度 PCB 布局）
- 等级：AEC‑Q200（车规）
三、产品特点与优势
- 高频性能良好：Q 值在 500 MHz 时为 14，自谐振频率至 2.2 GHz，适合射频匹配、滤波与去耦应用。
- 体积极小：0201 超小封装，利于缩减 PCB 面积和实现高密度布线。
- 车规可靠性：满足 AEC‑Q200 要求，耐温、耐振动性能适合车载环境。
- 精度高：±3% 精度有利于高频网络中控制谐振/阻抗精确度。
四、典型应用场景
- 射频前端：匹配网络、阻抗变换、谐振回路中用作高频电感。
- EMI/EMC：高频噪声滤波、共模/差模抑制（在高阻抗路径上效果更佳）。
- 通信设备：滤波器、巴伦、陷波器等 RF 子电路。
- 车载电子与工业控制：在受温度和可靠性要求严格的环境中使用。
五、设计与使用建议
- 电流与 DCR：器件 DCR 较高（1.31 Ω），导致在低阻抗或大电流电源路径上会有显著压降与功耗，建议用于高阻抗信号线或 RF 匹配网络，而非作为电源线电感。
- 电流裕量：额定 150 mA 为连续额定值，建议设计时留出 20–30% 余量以避免温升和饱和问题。
- 频率考量：SRF 为 2.2 GHz，上限频率附近电感特性开始退化，若工作频率接近或超过 SRF，应评估寄生电容影响。
- 焊接与回流：遵循厂方推荐回流温度曲线，避免过高温度或长时间滞留，以减少元件与焊点应力。超小封装在回流时需注意锡焊润湿性与元件位置偏移。
- PCB 布局：为保持高频性能，走线短、地平面完整。若用于滤波，输入/输出端滤波旁路电容尽量靠近器件布置，减少走线电感。
六、质保与储存
- 车规认证：通过 AEC‑Q200，适合车载应用的环境应力要求。
- 储存与搬运：避免机械冲击与潮湿，按标准贴片元件防潮等级存放，开封后建议在规定时间内完成回流焊接或进行封装保管。
如需器件的封装尺寸图、频率响应曲线（L、Q vs. f）、回流曲线或样品与大货交期信息，可提供更详细型号资料以便进一步确认与选型。
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