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TDK C3225X7S2A475KT000N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK C3225X7S2A475KT000N
- Type
- TDK
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C3225X7S2A475KT000N
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.15g
- Electronic Component
- 1
- Electronic Component
- BM0116143730
- Electronic Component
- X7S
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C3225X7S2A475KT000N 产品概述
一、基本信息
产品名称：贴片电容（多层陶瓷电容 MLCC）
型号：C3225X7S2A475KT000N
品牌：TDK
封装：1210
额定电压：100V
电容值：4.7μF
容差：±10%
材料特性：X7S类电介质（-55°C至+125°C，温度系数±22%）
二、产品特性
C3225X7S2A475KT000N 是一款高性能的多层陶瓷电容（MLCC），主要应用于电子设备和电路设计中，以其出色的电气特性和稳健的机械性能在市场中广受欢迎。下面我们详细分析其主要特性：
容量与电压特性：该电容的额定电压为100伏，能够处理高压电路的需求，确保在各种工作条件下的稳定性。其电容值为4.7微法拉（μF），适用于滤波、耦合、去耦和其他相关应用。±10%的质差容许范围，使得工程师在设计电路时有足够的灵活性。
优良的温度稳定性： X7S材料使得该电容在-55°C至+125°C的宽温范围内保持稳定，其电容值在此范围内的变化仅为±22%。这样的特性对于高温或低温工作环境中的电子设备至关重要，比如汽车电子、航空航天以及消费电子产品等。
封装设计：该电容采用1210封装，这是一种标准化的贴片封装，适合表面贴装技术（SMT）应用。1210封装尺寸为3.2mm x 2.5mm，方便电子电路的设计与布局，能够有效节省电路板的空间并降低整体产品的体积。
机械及电气性能：C3225X7S2A475KT000N 的陶瓷基材和内部结构设计提供了良好的机械强度和抗震性能，适合在要求苛刻的环境中使用。此外，MLCC的低ESR（等效串联电阻）特性使得其在高频应用中表现优异，减少了能量损耗及发热。
三、应用领域
C3225X7S2A475KT000N广泛应用于多种电子产品与电路设计中，包括但不限于：
- 消费电子：如手机、平板电脑、笔记本电脑以及其他个人电子设备的电源管理与信号处理。
- 汽车电子：汽车电控单元（ECU）、传感器及其它电子控制系统，确保在恶劣环境下的可靠性。
- 通信设备：用于基站、路由器、交换机等高频电路中，以保证信号输送的稳定性。
- 工业设备：在制造业、自动化设备等应用中，提供可靠的储能及滤波功能。
四、竞争优势
在众多竞争品牌中，TDK以其优质的产品和严格的质量控制著称。C3225X7S2A475KT000N不仅符合国际标准，还通过了多项认证，确保了产品的安全性和可靠性。此外，TDK 提供的技术支持与客户服务为设计工程师在产品开发中提供了全面的保障。
五、总结
总之，C3225X7S2A475KT000N 是一款性能卓越、适用广泛的贴片电容，凭借其优异的电气性能和可靠的机械特性，在现代电子电路设计中扮演着不可或缺的角色。无论是高温环境下的汽车应用还是高频通信设备，其表现都能满足严格的技术要求，为工程师提供了强有力的支持。
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