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TDK MLG0603P3N0BTZ10
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLG0603P3N0BTZ10
- Type
- TDK
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603P3N0BTZ10
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.009g
- Inductor
- 3nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0262575928
- Current
- 450mA
- Frequency
- 7.5GHz
- Resistor(DCR)
- 200mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603P3N0BTZ10 产品概述
概要
MLG0603P3N0BTZ10 是由知名电子元器件制造商 TDK 推出的高性能贴片电感器。该产品属于0201 封装尺寸，适用于各种高频电子设备和系统中的滤波、匹配、能量存储等应用。
基础参数
- 电感值: 3 nH
- 这个电感值适合于高频应用，例如无线通信设备、射频模块和高频滤波器。
- Q 值: 14 @ 500 MHz
- 高 Q 值表示该电感器在特定频率下具有较低的损耗和较高的效率，特别适合需要高精度和低损耗的应用。
- 直流电阻 (DCR): 140 mΩ
- 低 DCR 有助于减少能量损失，提高系统的整体效率。
- 自谐振频率: 9.1 GHz
- 高自谐振频率确保了在高频范围内的稳定性能，不会因自谐振而引起不期望的共振。
- 额定电流: 450 mA
- 足够高的额定电流使其能够处理较大的电流，适用于需要高电流承载能力的应用。
封装和尺寸
- 封装类型: 0201
- 小型化的封装尺寸，使其非常适合现代电子产品中的空间有限场景，如智能手机、无线耳机、IoT 设备等。
品牌和可靠性
- 品牌: TDK
- 作为全球领先的电子元器件制造商，TDK 以其高品质和可靠性的产品而闻名。MLG0603P3N0BTZ10 产品继承了 TDK 的严格质量控制和先进制造技术。
应用场景
- 无线通信设备
- 在手机、基站设备、无线路由器等无线通信设备中，MLG0603P3N0BTZ10 可用于 RF 信号的匹配和滤波。
- 射频模块
- 由于其高 Q 值和低 DCR，非常适合用于射频模块中的滤波和匹配网络。
- 高频滤波器
- 可用于设计高频滤波器，确保信号在特定频段内保持清晰和稳定。
- IoT 设备
- 小尺寸和高性能使其成为 IoT 设备（如智能家居设备、穿戴式设备）中的理想选择。
技术优势
- 高频性能
- 该电感器在高频范围内表现出色的性能，特别是在 500 MHz 左右的频段中 Q 值达到 14，这使得它在需要高精度和低损耗的应用中具有显著优势。
- 低损耗
- 低 DCR 和高 Q 值共同确保了能量的有效利用，减少了系统中的热量产生和能量浪费。
- 小尺寸
- 0201 封装尺寸使其非常适合现代电子产品中的紧凑设计需求。
使用注意事项
- 安装
- 由于其小尺寸，需要使用精密的贴片机进行安装，以确保正确的位置和连接。
- 热设计
- 在设计时需要考虑到热管理，因为高频操作可能会产生一定量的热量。确保周围有足够的散热空间或采用适当的散热措施。
- 兼容性
- 在选择 MLG0603P3N0BTZ10 时，需要确保其兼容性与其他系统组件，以避免不必要的信号干扰或兼容性问题。
总结
MLG0603P3N0BTZ10 是一款高性能贴片电感器，适用于各种高频电子设备和系统。其高 Q 值、低 DCR 和小尺寸封装使其成为现代电子产品设计中的理想选择。通过选择这个产品，工程师可以设计出更高效、更可靠且更紧凑的电子系统。
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