WMSIC Electronic Components

TDK MMZ0603Y750CT000

ModelMMZ0603Y750CT000
Package0201
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

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Technical data

Product details

20 specifications

Core information

Product name
TDK MMZ0603Y750CT000
Type
TDK
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MMZ0603Y750CT000
Electronic Component
1
Package
0201
Electronic Component
Ferrite Bead
Electronic Component
MMZ
Electronic Component
0g
Electronic Component
TDK Corporation
Electronic Component
1
Electronic Component
1
Electronic Component
BM0263492721
Type
Surface Mount
Operating Temperature
55°C ~ 125°C
Electronic Component
Active

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TDK MMZ0603Y750CT000 铁氧体磁珠产品概述

一、产品核心定位与基本属性

TDK MMZ0603Y750CT000 是信号线专用铁氧体磁珠,属于TDK经典的MMZ系列,针对高频电磁干扰(EMI)抑制设计,同时兼顾小型化与信号完整性需求。产品为有源元件,采用表面贴装封装,卷带(TR)包装适配自动化生产,广泛应用于消费电子、可穿戴设备、工业控制等领域的信号线路滤波。

二、关键电气性能参数

  1. 阻抗特性:在100MHz频率下阻抗为75Ω,是产品核心滤波指标——针对100MHz左右的高频噪声(如射频干扰、数字电路串扰),该阻抗可有效衰减干扰信号,同时对直流/低频信号传输影响极小。
  2. 电流与电阻:最大额定电流300mA,满足低压信号电路的电流需求;最大DC电阻(DCR)仅350毫欧,低电阻设计大幅减少信号传输损耗,避免信号压降影响电路性能。
  3. 温度适应性:工作温度范围覆盖-55℃至125℃,宽温特性可稳定适配工业环境、车载低温/高温场景,以及消费电子的极端使用工况。

三、机械与封装规格

  1. 超小型封装:采用0201(公制0603)封装,具体尺寸为0.60mm(长)×0.30mm(宽)×0.33mm(高),是当前主流小型化电子设备的适配封装,可显著节省PCB空间,适合高密度电路设计。
  2. 安装与包装:表面贴装型(SMD)设计,兼容自动化贴装产线,提升生产效率;卷带(TR)包装每盘数量适配批量生产,减少人工上料成本。

四、典型应用场景

  1. 消费电子:智能手机、平板电脑的射频信号线(如Wi-Fi、蓝牙天线)、音频接口(耳机、麦克风)滤波,抑制高频噪声对信号质量的影响;
  2. 可穿戴设备:智能手表、手环的传感器数据传输线(如心率、加速度传感器)滤波,小尺寸适配设备紧凑空间;
  3. 工业控制模块:小型传感器(如温度、压力传感器)、低功耗通信模块(如LoRa、ZigBee)的信号抗干扰,宽温特性满足工业现场需求;
  4. 车载辅助电路:车载低功耗信号线路(如CAN总线分支、小功率传感器信号)滤波,适配车载-40℃至85℃的常规工作温度。

五、产品优势与实际价值

  1. 空间效率高:0201封装比传统0402封装体积缩小约60%,适合便携设备的“轻薄化”设计;
  2. 滤波精准性:100MHz下75Ω阻抗针对性强,可有效隔离目标频率干扰,不影响低频信号(如音频、控制信号)传输;
  3. 可靠性稳定:宽温范围与TDK铁氧体材料的稳定性,确保长期使用中阻抗、电阻参数无明显漂移;
  4. 生产兼容性好:表面贴装+卷带包装,适配多数SMT产线,降低组装难度与成本。

六、选型与使用注意事项

  1. 电流匹配:电路工作电流需低于300mA,避免磁珠饱和导致滤波性能下降或发热;
  2. 频率适配:若干扰频率偏离100MHz(如低于50MHz或高于200MHz),需确认阻抗是否满足需求;
  3. PCB设计:0201封装需对应焊盘尺寸(通常推荐0.3mm×0.4mm焊盘),避免焊接不良;
  4. 应用场景:仅适用于信号线路(如传感器、通信信号),不建议用于电源滤波(电源电流通常大于300mA)。

该产品凭借小型化、精准滤波与宽温可靠性,成为信号线路EMI抑制的高性价比选择,覆盖从消费电子到工业控制的多场景需求。

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