WMSIC Electronic Components

TDK MLG1005S10NHT000

TDK MLG1005S10NHT000
1 / 2

Product image

ModelMLG1005S10NHT000
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
TDK MLG1005S10NHT000
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLG1005S10NHT000
Electronic Component
1
Package
0402
Electronic Component
SMD Inductor
Electronic Component
±3%
Electronic Component
0.012g
Inductor
10nH
Electronic Component
1
Factor
8@100MHz
Electronic Component
BM0084392154
Current
500mA
Frequency
2.5GHz
Resistor(DCR)
220mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：MLG1005S10NHT000 高性能表面贴装电感器

一、基本信息

MLG1005S10NHT000是TDK公司生产的高品质表面贴装电感器，属于其多层电感系列。该产品采用陶瓷材料作为磁芯，具备无磁性特性，使其在高频应用中表现出色。其核心参数包括电感值为10nH，容差为±3%，最大额定电流为500mA。该电感器的DC电阻（DCR）最大为350毫欧，确保在高负载条件下的低功耗表现。其自谐振频率高达2.5GHz，适合用于各种高频、高速电路设计。

二、技术规格

  1. 电感值：10nH，适合用于高频应用的圈式拓扑结构。
  2. 容差：±3%，保证了电感值的精确度。
  3. 额定电流：500mA，能够满足大量电子应用中的电流需求。
  4. DC电阻（DCR）：最大350毫欧，说明其在工作时的能量损耗较低。
  5. Q值：在100MHz频率下，此电感的Q值为8，反映出在此频率下良好的能量储存和释放能力。
  6. 自谐振频率：高达2.5GHz，显示出其在高频场合的适应能力以及低信号衰减。
  7. 工作温度范围：-55°C至125°C，适用于极端环境条件，保证其在不同应用场合的稳定性。
  8. 安装类型：表面贴装型（SMD），方便在现代电路板上以自动化方式进行贴装。
  9. 封装尺寸：0402（1005公制），具体尺寸为1.00mm x 0.50mm，适合于空间受限的电子设计。

三、应用场景

MLG1005S10NHT000电感器主要应用于高速信号传输及射频设备中，适合于以下场景：

  • 通信设备：在无线通信、蓝牙、Wi-Fi等高速数据传输设备中，起到滤波、共模扼流圈等作用。
  • 消费电子：广泛用于智能手机、平板电脑、可穿戴设备等产品中，以提高信号完整性和降低干扰。
  • 汽车电子：在汽车的安全监控、导航系统及娱乐信息系统中，确保信号处理的高效和稳定。
  • 工业应用：适用于各种传感器和控制器等应用场合，尤其是在温度变化较大的环境中。

四、性能优势

  1. 高频特性：其自谐振频率达到2.5GHz，适合严苛的高频电路条件，避免信号回流。
  2. 低DCR：较低的DC电阻确保在工作中产生的热量较少，从而提高元器件和设备的整体能效。
  3. 极宽的工作温度范围：适合于各种极端环境，确保设备在不同的气候和工作条件下稳定运行。
  4. 小型封装设计：0402封装适应现代电子设备小型化趋势，有助于节省空间，提高设计灵活性。

五、总结

总的来说，MLG1005S10NHT000是一款极具竞争力的高性能表面贴装电感器，凭借其优越的频率特性、稳定的电流承载能力及适应极端环境的能力，成为当前各种高频电子应用中不可或缺的重要器件。无论是在消费类电子产品、通讯设备还是工业控制领域，该电感器都能提供可靠的性能支持，助力产品设计和开发的成功。TDK凭借其领先的技术和创新的设计，确保了MLG1005S10NHT000电感器在行业中的高标准与高质量。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.