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TDK CGA2B2C0G1H220JT0Y0F
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK CGA2B2C0G1H220JT0Y0F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B2C0G1H220JT0Y0F
- Electronic Component
- 1
- Electronic Component
- 22pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0257285457
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA2B2C0G1H220JT0Y0F 产品概述
一 基本参数与核心特性
TDK 型号 CGA2B2C0G1H220JT0Y0F 是一款 0402 封装的多层陶瓷贴片电容（MLCC），标称电容 22 pF，容差 ±5%（J），额定电压 50 V，介质材料为 C0G（也称 NP0）。该器件特点为温度系数极低、介质损耗小、频率特性优异，适合对稳定性和低噪声有严格要求的电路。
二 电气性能与可靠性
C0G/NP0 为一级温度特性，温漂近 0 ppm/°C，随温度、频率和时间的电容变化非常小，长期稳定性好，几乎无电气老化效应。与 X7R 等高介电常数材料相比，C0G 在直流偏置下的电容变化非常微小，等效串联电阻（ESR）和等效串联电感（ESL）较低，Q 值高，适合射频与滤波应用。典型测试频率常用 1 MHz 或射频范围内测量，具体参数请参考 TDK 官方 Datasheet。
三 典型应用场景
- 高频旁路与去耦（射频前端、混频器、LNA 等）
- 谐振回路与滤波器（振荡器电路、陶瓷谐振匹配）
- 精密定时与 RC 网络（要求温度稳定的计时、延时电路）
- 传感器前端与测量仪器（低漂移、低噪声场合）
四 PCB 设计与封装建议
0402（公制约 1.0 mm × 0.5 mm）适合高密度贴装。为降低热机械应力及避免裂纹，应采用 TDK 推荐的焊盘尺寸与过孔布局，焊盘对称并留足阻焊开窗，避免锣边距过小。高可靠性场景建议在 PCB 布局时预留应力缓冲区，减少板弯曲影响。
五 焊接与装配注意事项
该系列适用于无铅回流焊工艺，应遵循 JEDEC/J-STD-020 建议回流曲线，避免超温或过长高温暴露时间。0402 体积小，拾取与贴装需使用合适吸嘴，回流后建议实施外观与焊接质量检查。对潮湿敏感度较低，但长期暴露于高湿环境前应参考厂方烘烤与潮气敏感等级（MSL）建议。装配与测试时注意静电防护与清洗工艺对焊点的影响。
六 选型与替代建议
选择时确认工作电压、环境温度、频率范围与封装兼容性。若需同等性能可参考村田、京瓷、三星等厂商同规格 C0G（NP0）0402 22 pF/50 V ±5% 产品，但具体尺寸、焊盘建议与可靠性规范仍应以各厂 Datasheet 为准。常见采购形式为卷带（tape & reel），常见卷盘数量范围数千至一万颗，具体包装与交期以供应商报价为准。
如需更详细的电气模型（ESR/ESL、S参数）、推荐焊盘尺寸或 Datasheet 原文，我可以帮您检索并提取相关关键数据。
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