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TDK MLF2012A1R0JT000
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLF2012A1R0JT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLF2012A1R0JT000
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.042g
- Inductor
- 1uH
- Electronic Component
- 1
- Factor
- 45@10MHz
- Electronic Component
- BM0258752421
- Current
- 80mA
- Frequency
- 120MHz
- Resistor(DCR)
- 150mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLF2012A1R0JT000 — TDK 贴片电感（0805，1.0 μH，±5%）
一、产品概要
MLF2012A1R0JT000 为 TDK 系列0805（2012 公制）贴片电感，额定电感值 1.0 μH，公差 ±5%。直流电阻（DCR）典型值 150 mΩ，额定直流电流 80 mA。在 10 MHz 时品质因数 Q≈45，自谐振频率（SRF）约 120 MHz。结构紧凑，适合对体积和高频性能有要求的便携与射频前端电路。
二、主要特性
- 小型封装（0805）便于高密度 PCB 布局与自动化贴装；
- 低 DCR（150 mΩ）降低直流损耗，适合对效率敏感的滤波场合；
- 高 Q（45@10 MHz）表示在中高频段有良好选择性与较低插入损耗；
- SRF≈120 MHz，使用时需注意高于该频率电感呈现容性行为；
- 额定电流 80 mA，建议在设计中考虑电流去等级与温升。
三、典型应用
- 高频滤波与阻抗匹配（RF 前端、天线匹配）；
- 模拟信号滤波、共模/差模滤波器的串联元件；
- 低功耗便携设备的电源去耦与 EMI 抑制；
- 小型 DC-DC 转换器中的滤波与储能应用（在电流限制内）。
四、使用与布局建议
- 尽量靠近噪声源或电源引脚放置以提高滤波效果；
- 与旁路/耦合电容构成 LC 网络时，注意器件间寄生电容对 SRF 的影响；
- 对于需要保持电感值的应用，应确保工作电流低于额定 80 mA，避免磁饱和和显著 L 值下降；
- 推荐采用符合 IPC 的 0805 焊盘，保证良好焊接热量和力学支撑。
五、可靠性与检验
- 支持回流焊工艺，建议按厂商回流曲线控制峰值温度与时间；
- 出厂常规电气参数检验：L（1 kHz 或指定频率）、DCR、Q、SRF 等；
- 储存与贴装按湿敏等级与防潮要求处理，避免焊接缺陷与性能漂移。
六、包装与选型提示
- 常见包装为卷带（tape & reel），便于 SMT 自动化生产；
- 选型时对比 DCR、Q 与 SRF，以匹配目标频段与允许功耗；
- 若电流或饱和特性为关键项，建议向供应商索取详细电流-电感曲线与热阻数据。
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