WMSIC Electronic Components

TDK MLF2012A4R7KT000

ModelMLF2012A4R7KT000
Package0805
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MLF2012A4R7KT000
Type
TDK
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLF2012A4R7KT000
Electronic Component
1
Package
0805
Electronic Component
SMD Inductor
Electronic Component
±10%
Electronic Component
0.042g
Inductor
4.7uH
Electronic Component
1
Factor
45@10MHz
Electronic Component
BM0169015136
Current
30mA
Frequency
50MHz
Resistor(DCR)
350mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MLF2012A4R7KT000 贴片电感

MLF2012A4R7KT000是一款由著名电子元器件制造商TDK生产的高性能贴片电感器,广泛应用于各种电子装置中,尤其是在对尺寸、性能和可靠性要求较高的电路设计中。此款电感的设计结合了多层结构与优质的铁氧体材料,使其在现代电子应用中展现出色的电气性能。

主要参数

  1. 电感值与容差:MLF2012A4R7KT000的电感值为4.7µH,容差为±10%,这使得其在电路中提供了可靠的电感特性,同时兼顾了设计灵活性。

  2. 额定电流:该电感的额定电流为30mA,适合处理低功耗的信号,从而确保在特定应用条件下的稳定工作。

  3. 直流电阻(DCR):最大直流电阻为700毫欧,这一特性对于要求低能耗和高效率的电路非常关键。

  4. Q值与自谐振频率:该电感在10MHz频率下的Q值为45,在50MHz的自谐振频率下运行。这一高Q值意味着电感在信号传输过程中具有低损耗特性,适合高频应用场合,如射频(RF)和高速数字电路。

  5. 温度范围:其工作温度范围广泛,从-55°C到125°C,能够在各种不同的环境条件下稳定使用,包括严苛的工业与汽车电子应用。

  6. 封装与尺寸:MLF2012A4R7KT000采用0805(2012公制)表面贴装封装,尺寸为2.00mm x 1.25mm,适合紧凑的PCB设计,并能有效提升设备的空间利用率。

  7. 屏蔽特性:此型号具有屏蔽设计,以降低电感器在高频应用中的电磁干扰(EMI),从而提升整体电路的稳定性和性能。

应用场景

MLF2012A4R7KT000广泛适用于以下应用:

  • 无线通信:在信号调理、电源管理及滤波电路中提供必要的电感特性,提高信号质量和系统效率。

  • 数字电路:在高频数字电路中作为去耦电感,增进电源稳定性并减少电磁干扰。

  • 消费电子:适合用于智能手机、平板电脑、笔记本电脑等小型化电子设备中的电源管理和信号处理电路。

  • 工业控制:在传感器、控制器和转动部件中,使用该电感能够改善电路的响应时间和信号质量。

总结

MLF2012A4R7KT000是一款高性能、高可靠性的贴片电感,凭借其卓越的电气性能、多样化的应用场景和紧凑的封装设计,成为现代电子产品设计中的理想选择。无论是在射频设备、数字电路还是工业控制系统中,它都能有效提升电路性能,满足高频及低能耗的关键需求。选择TDK的MLF2012A4R7KT000,将为您的电子设计增添更多的灵活性与性能优势。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.