WMSIC Electronic Components

TDK C3216C0G2J471JT000N

ModelC3216C0G2J471JT000N
Package1206
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

16 specifications

Core information

Product name
TDK C3216C0G2J471JT000N
Type
TDK
Minimum package
4000

Technical parameters

Electronic Component
TDK
Electronic Component
C3216C0G2J471JT000N
Electronic Component
1
Electronic Component
470pF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.063g
Electronic Component
1
Electronic Component
BM0230590453
Electronic Component
C0G
Voltage
630V
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

C3216C0G2J471JT000N 产品概述

一、产品简介

TDK 型号 C3216C0G2J471JT000N 为贴片多层陶瓷电容(MLCC),公称容值 470 pF,精度 ±5%,额定电压 630 V,温度系数为 C0G(又称 NP0),封装为 3216(1206 英寸)。该元件定位为高稳定性、低损耗的精密陶瓷电容,适用于对温漂和频率响应有较高要求的电路。

二、主要技术参数

  • 容值:470 pF
  • 容差:±5%(J)
  • 额定直流电压:630 V
  • 温度特性:C0G / NP0(近零温漂,典型 ±30 ppm/°C 量级)
  • 封装:3216(1206)贴片
  • 类型:多层陶瓷电容(MLCC)

三、性能特点

  • 温度稳定性优异,C0G 型介质在宽温区间内电容量变化极小,适合精密滤波、谐振与定时电路。
  • 介质损耗低、等效串联电阻(ESR)和等效串联电感(ESL)较小,表现出较高的自谐频率与良好的高频特性。
  • 在直流偏压下电容量变化很小(相较于 II 类介质),适合高电压直流或高精度测量场合。
  • 1206 体积兼顾电压耐受与 PCB 可装配性,便于手工与贴片生产线加工。

四、典型应用场景

  • 高频滤波、射频匹配、谐振回路与谐振器件中作为精密定容元件。
  • 仪表与精密模拟前端,用于滤波与耦合,保证温度稳定性与相位稳定性。
  • 高压电源、HV 测试平台与电力电子中用于高压旁路或分压网络(需注意额定与工况)。
  • 医疗、电力、仪器仪表等要求长期稳定性的场合。

五、设计与使用建议

  • 虽然 C0G 对直流偏压敏感性低,但在接近额定电压长期工作时仍建议留有裕度,必要时采用串联或并联布局优化电压分担与容值。
  • 布局时将电容尽量靠近信号源/地线,缩短走线以降低寄生,避免机械应力集中在焊盘导致开裂。
  • 参考 TDK 官方数据手册确认自谐频率、耐压试验、温度范围与可靠性(如耐焊接温度、湿敏等级 MSL 等)以满足生产与认证要求。
  • 焊接遵循推荐回流曲线,避免过长高温滞留;波峰或手工焊接时注意热冲击控制。

六、封装与采购提示

型号编码中 C3216 表示 3216 公制封装(1206),“471” 指 470 pF,“J” 表示 ±5% 容差,后缀为包装与出厂批次信息。采购时可确认 TDK 提供的包装形式(卷带等)、计数与可追溯性,以便生产管理与质量控制。

如需进一步的电气参数(自谐频率、介质搁置特性、寿命与加速应力测试结果),建议参考 TDK 官方产品资料或直接联系 TDK 技术支持获取完整数据表。

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