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TDK MLG1005S39NJTD25
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLG1005S39NJTD25
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S39NJTD25
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Inductor
- 39nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0264801999
- Electronic Component
- AEC-Q200
- Current
- 250mA
- Frequency
- 1.2GHz
- Resistor(DCR)
- 650mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S39NJTD25 — TDK 0402 39nH 贴片电感产品概述
一、产品简介
MLG1005S39NJTD25 为 TDK 提供的高可靠性贴片电感，封装尺寸为 0402（1005 公制），电感值 39 nH，公差 ±5%。该器件为车规级（AEC‑Q200）零件，适用于对空间、温度和可靠性有较高要求的电子设备，特别是在射频与高频信号链路以及 EMI 抑制场合。
二、主要参数与性能
- 电感值：39 nH ±5%
- 额定电流：250 mA
- 直流电阻（DCR）：650 mΩ
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：1.2 GHz
- 车规等级：AEC‑Q200
- 封装：0402（1005 公制）表贴
该器件在 100 MHz 附近表现出中等 Q 值（≈8），SRF 达到 1.2 GHz，说明在 VHF–UHF 频段仍可用于匹配或滤波。较高的 DCR（650 mΩ）与较低的额定电流表明其更适合信号线滤波与阻抗调整，而非大电流电源滤波。
三、典型应用场景
- 高频阻抗匹配与输入/输出网络
- 信号线 EMI/EMC 抑制与噪声隔离（差分或单端线）
- 射频前端的去耦或谐振元件（在 SRF 附近需注意相位变化）
- 汽车电子中对体积和可靠性有严格要求的小信号滤波
四、布局与使用建议
- 由于封装为 0402，建议采用与制造商推荐一致的 PCB 焊盘设计，避免过大应力集中导致焊点裂纹。
- 器件 DCR 较高，若用于传输线或电源路径需评估压降与发热；额定电流 250 mA 为上限值，长时间应用应留有安全裕量。
- 在接近 SRF 的频段器件呈现容性行为，设计时需考虑频率响应的相位与幅值变化。
- 遵循制造商的回流焊工艺规范（无铅回流温度曲线）以保证焊接可靠性。
五、可靠性与品质保证
该型号符合 AEC‑Q200 标准，适用于汽车电子和高可靠性工业应用。TDK 的生产与测试流程保证了元件的温度循环、振动和长期稳定性。建议在关键应用中参考官方数据手册进行额定环境与寿命评估。
六、封装与订购信息
- 封装：0402（1005 公制）贴片
- 品牌：TDK
- 型号：MLG1005S39NJTD25
如需量产或更详细的电气/机械特性（如温度系数、海拔/湿度应力数据、推荐焊盘尺寸和回流曲线），请查阅 TDK 官方数据手册或联系授权代理商获取完整技术支持。
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