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TDK C1005X6S1C105KT000E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- TDK C1005X6S1C105KT000E
- Type
- TDK
- Minimum package
- 10000
Technical parameters
- Electronic Component
- TDK
- Electronic Component
- C1005X6S1C105KT000E
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0228037179
- Electronic Component
- X6S
- Voltage
- 16V
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK C1005X6S1C105KT000E 产品概述
一、产品简介
TDK C1005X6S1C105KT000E 为贴片多层陶瓷电容（MLCC），标称容量 1 µF，公差 ±10%（C），额定电压 16 V，介质材料 X6S，封装为 0402（公制约 1.0 mm × 0.5 mm）。该型号属于高容值、小体积的通用去耦/滤波型电容，适用于对体积有严格限制的移动终端、消费电子与高密度电路板设计。
二、主要特性
- 容值与精度：1 µF ±10%，适合常规去耦与电源旁路用途。
- 额定电压：16 V，适合中低压电源轨。
- 介质 X6S：工作温度范围宽（可覆盖低温至高温工况），兼顾较高的容值与温度特性，适用于需在-55°C 至 +125°C 区间运行的场合（具体温度性能及允许偏差请参见 TDK 规格书）。
- 封装 0402：体积小、可实现高密度布板，但其容值在小封装下受工艺与偏置影响较明显。
- 优点：体积小、ESL/ESR 低（相对其他封装）、适合高速去耦、可在自动贴装与回流工艺中可靠实现。
三、应用场景
- 电源去耦与旁路（CPU、SoC、电源管理 IC）
- 移动设备、便携式终端、相机和可穿戴设备等空间受限产品的滤波网络
- DC-DC 转换器输入/输出滤波、模拟前端稳定与电磁兼容（EMC）补偿
四、设计与使用注意事项
- 直流偏置效应：X6S 为高介电常数陶瓷，工作时随施加直流电压容量会出现下降，实际有效容值可能低于标称，设计时应考虑偏置影响并留有裕量。
- 温度依赖：虽然 X6S 工作温度范围宽，但在极端温度点电容值会有规定的变化，关键电路请参考数据手册中的温度系数曲线。
- 焊接与工艺：支持贴片回流焊，推荐按照 TDK 建议的焊接温度曲线与 PCB 焊盘尺寸，以减少热应力与开裂风险。0402 小型封装对机械应力敏感，避免在装配或测试过程中施加过大挤压力。
- 老化与可靠性：陶瓷电容有老化现象（容量随时间缓慢下降），对长期性能有严格要求的场合需进行验证。
五、封装与布局建议
- 0402（C1005）体积非常小，建议靠近被去耦的器件电源引脚放置以降低回路电感。
- 保持最短的焊盘间连线与合适的焊盘尺寸，确保良好焊接质量与热流。
- 对于高脉冲或高纹波场合，若发现容量或温漂不足，可考虑使用更大封装（如 0603/0805）或提高额定电压以减少偏置损失。
六、替代与选型建议
在需要更佳温度稳定性或低偏置损失时，可比较 X7R、C0G（NPO）等介质：X7R 在温度稳定性方面常优于 X6S，而 C0G 提供线性、极低损耗的电容特性但难以做到同等容值与体积。若电路对有效容量敏感，优先考虑封装尺寸放大或额定电压上备。
如需更详细的电气参数（直流偏置曲线、寿命试验、尺寸公差与回流曲线），建议查阅 TDK 官方规格书或联系供应商获取完整技术资料。
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