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TDK MLF1005G2R2KT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLF1005G2R2KT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLF1005G2R2KT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Inductor
- 2.2uH
- Electronic Component
- 1
- Factor
- 30@10MHz
- Electronic Component
- BM0058430414
- Current
- 30mA
- Frequency
- 80MHz
- Resistor(DCR)
- 990mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLF1005G2R2KT000 产品概述
一、产品简介
MLF1005G2R2KT000 为 TDK 系列贴片电感，封装0402（公制1005），标称电感值 2.2 μH，公差 ±10%。此器件为小型高电感量芯片电感，适用于对体积敏感且电流需求较低的电子电路中，用于滤波、阻抗匹配与去耦等场合。
二、主要电气参数
- 电感值：2.2 μH ±10%
- 额定直流电流：30 mA
- 直流电阻（DCR）：990 mΩ（0.99 Ω）
- 品质因数（Q）：30 @ 10 MHz
- 自谐振频率（SRF）：80 MHz
- 封装：0402（1005 公制）
这些参数表明器件在低电流工作条件下具有较高电感量及在 MHz 级别仍保持一定 Q 值，SRF 在 80 MHz 左右限制了其高频使用上限。
三、典型应用场景
- 低功耗传感器前端滤波与去耦
- 小型通信模块中的低频/中频滤波（工作频率应远低于 SRF）
- 模拟电路的信号隔离与阻抗匹配
- 精密测量电路中的噪声抑制
由于额定电流仅 30 mA，推荐用于小信号或低电流路径，避免直接用于大功率电源滤波。
四、选型与注意事项
- 电流限制：额定电流为 30 mA，超过该值会导致电感饱和或温升增大，应留有裕量。
- DCR 与功耗：990 mΩ 的较高直流电阻在通过电流时会产生显著压降与发热，设计时需考虑功耗影响。
- 频率限制：工作频率应低于自谐振频率 80 MHz，接近 SRF 时电感特性将改变，需参考频率响应曲线。
- 温度与环境：高温或高湿环境会影响电感性能与寿命，装配与回流焊请遵循厂商工艺规范。
- 布局建议：0402 大小易受焊盘设计与贴装应力影响，建议采用推荐焊盘尺寸并控制焊盘过孔与机械应力。
五、封装与装配
0402（1005）微小封装适合高密度贴片 PCB 应用，但同时对贴片与焊接精度要求较高。推荐采用标准回流焊流程，严格控制温度曲线并在贴装后进行视觉/自动光学检查，必要时做电气测试以验证电感值与 DCR。
六、小结
MLF1005G2R2KT000 是一款适用于低电流、体积受限场合的 2.2 μH 贴片电感，具有适中的 Q 值与 80 MHz 的自谐振频率。选型时应重点关注额定电流、DCR 对电压降与发热的影响，以及工作频率相对于 SRF 的裕量，才能确保电路长期稳定可靠。若需更详细的频率响应或热特性曲线，建议查阅 TDK 官方器件数据手册。
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