WMSIC Electronic Components

TDK C1005C0G1H100DT000F

ModelC1005C0G1H100DT000F
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
TDK C1005C0G1H100DT000F
Type
TDK
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
C1005C0G1H100DT000F
Electronic Component
1
Electronic Component
10pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0257285770
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

C1005C0G1H100DT000F 产品概述

一、简介

C1005C0G1H100DT000F 为 TDK 生产的表面贴装多层陶瓷电容(MLCC),封装为 0402(即公制 1005),标称电容值 10 pF,额定电压 50 V,介质类别为 C0G(也称 NP0)。该产品以温度稳定性高、损耗低、机械尺寸小而著称,适合对频率特性和温漂要求较高的应用场景。

二、主要性能特点

  • 电容值:10 pF,适用于高频耦合、滤波与振荡网络。
  • 额定电压:50 V,满足多种板级信号与电源旁路要求。
  • 温度系数:C0G(Class 1),温度系数接近 0 ppm/°C(典型 ±30 ppm/°C 级别),温漂极小。
  • 损耗低、Q 值高,对信号失真和相位误差影响极小。
  • 电压系数小,直流偏压下电容变化可忽略(相比高介电常数材料稳定得多)。
  • 老化几乎为零,长期可靠性优良,适合精密计时与测量电路。

三、典型应用

  • 高频信号耦合与阻抗匹配:射频前端、滤波器、微波匹配网络。
  • 振荡器与时钟电路:晶体振荡器、LC 振荡回路中作为定时元件。
  • 精密模拟电路:ADC、DAC 输入/采样网络、精密放大器的反馈/补偿电容。
  • 低损耗信号通路:仪表、传感器接口、通信线路中对相位与幅度保持要求高的地方。
  • 一般旁路与去耦(在高频段表现优异)。

四、封装与可靠性注意事项

  • 0402 小尺寸封装在高密度贴装中优势明显,但对贴装工艺敏感:需采用合适的焊盘设计与回流温度曲线,并尽量避免过度机械应力(如弯曲 PCB 或强力擦拭)。
  • 建议遵循制造商的 PCB 焊盘与过孔布局推荐,保证焊锡包覆与润湿良好以避免虚焊或应力集中。
  • 回流焊温度应参考 TDK 的工艺资料,通常针对无铅回流峰值温度控制在推荐范围内(具体请参照厂家数据表)。
  • 储存与搬运:避免重压与尖锐碰撞;在贴装前若包装已打开,应按一般 SMT 组件操作,避免污染焊盘表面。

五、选型与替代建议

  • 若电路对温度稳定性与低损耗要求极高,C0G/NP0 系列为首选;如需更大电容值或更高电压,可选用不同封装或介质等级的 MLCC。
  • 替代品牌可考虑 Murata、KEMET、AVX 等同规格 C0G 10 pF 50 V 0402 器件,但在精密应用中建议对比温漂、损耗与封装工艺的一致性后替换。
  • 在高频设计中,注意与布局、寄生电感、电阻的配合,必要时进行仿真和实测调校。

六、结论与建议

C1005C0G1H100DT000F 适用于对温度稳定性、频率响应和长期稳定性有高要求的电路,尤其在 RF、振荡及精密模拟场合表现优异。选用时注意焊接工艺与机械应力控制,替代器件应重点对比 C0G 特性与封装一致性。若需更详细的电气参数和回流工艺数据,请参考 TDK 官方数据表以获得完整规范。

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