Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK CGA3E2C0G1H080DT0Y0N
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- TDK CGA3E2C0G1H080DT0Y0N
- Type
- TDK
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA3E2C0G1H080DT0Y0N
- Electronic Component
- 1
- Electronic Component
- 8pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0257285447
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA3E2C0G1H080DT0Y0N 产品概述
本产品为 TDK 贴片多层陶瓷电容（MLCC），额定参数为：容值 8 pF、额定电压 50 V、温度系数 C0G（又称 NP0）、封装 0603（1608 公制）。C0G 型陶瓷介质具有极好的温度稳定性和低损耗特性，适用于对频率稳定性和电容精度要求高的电路。
一、主要特性
- 容值：8 pF，适合小电容需求场合。
- 额定电压：50 V，可满足中等电压工作要求。
- 温度系数：C0G（±30 ppm/°C 级别或更优），在宽温度范围内电容值变化极小。
- 封装：0603（约 1.6 mm × 0.8 mm），体积小，适合高密度贴片组装。
- 低损耗、Q 值高，介电损耗角正切值小，适合高频应用。
- 良好的长期稳定性与低老化速率，适合精密模拟和时序电路。
二、典型应用场景
- 高频滤波与阻抗匹配（RF 前端、滤波网络）。
- 谐振电路与振荡器（时钟源、晶体伴随元件）。
- 高频耦合/去耦、采样保持电路中的精密电容元件。
- 模数/数模转换器周边的参考与补偿电容。
- 其他对温漂、线性度和低噪声有严格要求的电子系统。
三、封装与机械信息
- 标称封装 0603（1608），适合常规自动贴片生产线。
- 表面贴装型，端子电镀以确保良好焊接性（具体材料与涂层请以 TDK 数据手册为准）。
- 小尺寸带来布板灵活性，但在手工装配或维修时需要注意可视与操作难度。
四、焊接与使用建议
- 本类 MLCC 可承受常规回流焊工艺，建议遵循制造商提供的回流曲线与温度循环规范。
- 防止过度弯曲或机械冲击；0603 小尺寸对焊接应力和基板弯曲较敏感。
- 焊膏用量与焊盘设计应兼顾焊接可靠性与热应力释放，避免热应力集中导致裂纹。
- 贮存与贴装前应按抗潮包装开封条件处理，湿度敏感等级（MSL）及回流次数等以数据手册为准。
五、可靠性与测试要点
- C0G（NP0）材料本身具有极低的温漂与低老化特性，但仍建议在关键设计中进行环境与寿命验证（高温、高湿、温度循环等）。
- 对于射频与高频应用，推荐进行实际电路中的 S 参数或 Q 值验证，确认寄生电感、电阻对电路性能的影响。
- 订购与入库时注意批次、包装规格（卷带方向、带装数量）与质量放行文件。
六、选型与订购注意
- 完整料号包含更多信息（容差、终端表面处理、包装方式等），下单前请核对完整料号或咨询 TDK 数据手册以确认容差与包装规格。
- 若电路对容差、温漂或高频性能有更严苛要求，可考虑与供应商确认公差等级（如 ±1%、±5%）及测试曲线。
- 在批量生产前建议索取样品并进行板级测试，确保与实际系统兼容。
总结：CGA3E2C0G1H080DT0Y0N 是一款面向精密、高频与稳定性要求场景的 0603 MLCC，凭借 C0G 介质与 50 V 等级，适合射频、振荡和高精度模拟电路。选型与批量使用时请参照 TDK 官方数据手册与装配规范。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
