Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK C1608X5R1H104KT000N
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK C1608X5R1H104KT000N
- Type
- TDK
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C1608X5R1H104KT000N
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0257612832
- Electronic Component
- X5R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK C1608X5R1H104KT000N 产品概述
一、产品简介
TDK C1608X5R1H104KT000N 是一款多层陶瓷电容器（MLCC），为贴片安装（SMD/SMT）用型号，封装为 0603（公制 1608）。标称容量为 100 nF（0.1 µF），初始容差 ±10%，额定工作电压为 50 V，介质材料为 X5R。该器件适合对体积、可靠性与电性能有综合要求的通用电子电路。
二、主要规格
- 容值：100 nF（0.1 µF）
- 初始容差：±10%（K）
- 额定电压：50 V DC
- 介质：X5R（温度系数型陶瓷）
- 封装：0603（1608 公制）
- 封装形式：SMD / SMT，多层结构
三、特性与优势
- 体积小、容值密度高：0603 封装在有限空间内提供 100 nF，便于高密度组装。
- 稳定的电容特性：X5R 介质在常用工作温度范围内对容值有较好的保持能力，适合去耦、旁路与一般滤波用途。
- 低等效串联电阻与低等效串联电感（相对于插件电容）：有利于抑制高频噪声、提高电源稳定性。
- 贴片工艺兼容：适合回流焊与自动化贴片生产，提高制造效率与一致性。
- 品牌与可靠性：TDK 品牌，适用于工业级和消费电子的批量生产。
四、典型应用
- 电源旁路与去耦（单片机、模拟电路、电源模块）
- 高频滤波与耦合电路
- DC-DC 转换器输入/输出旁路
- 通信设备、消费电子、汽车电子（根据实际认证与使用条件评估）
五、安装与焊接注意事项
- 推荐按 PCB 制造商与 TDK 的焊盘设计指南设计焊盘，以获得良好机械强度与焊接可靠性。
- 避免在回流焊过程中超过器件热应力极限；遵循常见的无铅/有铅回流曲线与制造工艺要求。
- 防止过度弯曲或受力，0603 封装虽小但在机械应力下可能发生裂纹，建议在装配与检测时采取防护措施。
- 在高电压或高温场合，应考虑电容击穿、电容漂移及温度相关容值变化，必要时设计裕量。
六、质量与可靠性
MLCC 在正常使用条件下具有长期可靠性，但其电容值会受偏压（DC bias）和温度影响，X5R 介质在高偏压下容值可能出现下降。出于可靠性考虑，关键电路应进行样机测试和环境应力验证（如温循环、湿热、振动测试等），并根据实际应用选择合适额定电压与冗余设计。
七、采购与包装
- 型号：C1608X5R1H104KT000N（TDK）
- 建议在采购时确认库存与烘箱/干燥条件，避免潮湿引起回流焊缺陷。
- 大批量采购请参考供应商的数据手册与包装信息（卷盘包装规格、每盘数量等）。
以上为该型号的概述，适用于快速选型与电路设计参考。若需更详细的电气特性（如电压依赖曲线、温度曲线、尺寸图与推荐焊盘、可靠性测试数据），建议查阅 TDK 官方数据手册或联系技术支持以获取完整规范。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
