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TDK MLG1005S1N6BT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S1N6BT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S1N6BT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 1.6nH
- Electronic Component
- 1
- Factor
- 7@100MHz
- Electronic Component
- BM0058431623
- Current
- 1A
- Frequency
- 7.5GHz
- Resistor(DCR)
- 50mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S1N6BT000 — TDK 0402 叠层贴片电感 概述
一、产品概述
MLG1005S1N6BT000 为 TDK 0402（公制 1005）封装的叠层陶瓷贴片电感，标称电感量 1.6 nH，直流电阻约 50 mΩ，额定电流 1 A。该器件自谐振频率（SRF）高达约 7.5 GHz，100 MHz 时品质因数 Q ≈ 7。体积极小、频率特性良好，适用于高频信号路径中对体积与寄生电阻有严格要求的场合。
二、主要电气参数
- 电感值：1.6 nH
- 直流电阻（DCR）：≈ 50 mΩ
- 品质因数：Q = 7（测试频率 100 MHz）
- 自谐振频率：≈ 7.5 GHz
- 额定电流：1 A
- 类型：叠层（ML）贴片电感
- 封装：0402（1005 公制）
这些参数表明器件在 VHF 到 GHz 级别仍能维持电感性行为（直到 SRF），适合射频匹配、微带线补偿及高频滤波应用。
三、特性与优势
- 体积小、占板面积低：0402 封装便于高密度 PCB 设计与轻薄设备应用。
- 高频性能优良：SRF ~7.5 GHz，适用于 GHz 级信号链的阻抗控制与匹配。
- 低 DCR、较高额定电流：50 mΩ 与 1 A 额定电流使其在相对较高电流条件下仍有较低损耗。
- 叠层结构带来良好的温稳定性与制造一致性，适合量产 SMT 工艺。
四、典型应用
- 射频（RF）阻抗匹配网络与微带线补偿
- 高频滤波器（高频端的串联/并联电感）
- 信号链的去耦与旁路（用于高速接口的短路径隔离）
- 射频开关、放大器输入/输出回路与偏置网络
- 尺寸受限的移动终端、无线模块、射频前端模块（FEM）
五、使用与 PCB 布局建议
- 布线最短化：为减少寄生电感/电容与接地环路，封装到其它器件的走线应尽量短且宽。
- 接地策略：若用于偏置或旁路，确保电感两端与地的参考回路低阻抗，必要时在附近增加过孔降低回路阻抗。
- 阵列放置注意：0402 体积小，贴装时要注意贴片方向一致并留足焊盘长度，避免焊盘覆盖不足造成虚焊。
- 热管理与电流裕度：额定电流 1 A 为长期允许值，设计时考虑环境温度与散热条件，必要时预留电流裕度或采用并联器件。
- 焊接工艺：推荐采用标准回流焊工艺（无铅回流温度曲线），避免过长高温暴露以保护内部结构。
六、可靠性与注意事项
- 自谐振频率以上器件将表现为电容性，请在设计时避免在 SRF 附近直接当作电感使用。
- 对冲击与振动敏感度：0402 小型陶瓷器件对机械应力敏感，贴装与测试时避免强力挤压。
- 器件性能随温度、电流与频率变化，实际电路中建议做实际频域测量（S 参数或阻抗谱）以确认匹配与损耗。
总结：MLG1005S1N6BT000 以其小尺寸、低 DCR 与较高 SRF，在对体积、频率与损耗有严格要求的 RF 与高速电路中具有良好适用性。合理的 PCB 布局与热电流评估能确保其在实际应用中的稳定性与可靠性。
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