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TDK MLG1005S1N5BT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S1N5BT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S1N5BT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 1.5nH
- Electronic Component
- 1
- Factor
- 7@100MHz
- Electronic Component
- BM0255086186
- Current
- 1A
- Frequency
- 8GHz
- Resistor(DCR)
- 60mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK MLG1005S1N5BT000 产品概述
TDK MLG1005S1N5BT000 为 0402（1005公制）封装的叠层贴片电感，电感值 1.5 nH，额定电流 1 A，直流电阻（DCR）约 60 mΩ，品质因数 Q = 7（@100 MHz），自谐振频率（SRF）约 8 GHz。该器件针对高频微波与射频应用的小型化、高可靠性需求设计，兼顾低损耗与较高抗饱和电流能力。
一、主要参数一览
- 电感值：1.5 nH
- 额定电流：1 A（最大持续通流能力，实际使用建议考虑裕量）
- 直流电阻（DCR）：约 60 mΩ
- 品质因数：Q = 7（@100 MHz）
- 自谐振频率：SRF ≈ 8 GHz
- 类型：多层陶瓷叠层电感
- 封装：0402（1005 公制）
二、性能特点
- 小型化：0402 封装，节省 PCB 面积，适合密集布局与便携设备。
- 高频特性优越：SRF 达 8 GHz，可在 GHz 级频段维持电感特性，适合射频前端与匹配网络。
- 低 DCR：60 mΩ 有利于降低直流及低频损耗，改善系统效率和热耗散。
- 稳定性：多层陶瓷结构在温度与频率范围内具有较好的参数一致性与重复性。
三、典型应用场景
- 射频/微波匹配网络与阻抗变换（手机射频链路、蓝牙/Wi‑Fi 前端）
- 滤波器元件：输入/输出匹配、陷波或带通/低通滤波中用作串联电感元件
- 偏置隔离与旁路网络（偏置 Tee、RF 偏置隔离）
- 高频信号路径中作为阻抗元件或寄生补偿元件
四、使用建议与布局要点
- 布线尽量短且直，减少走线电感与辐射。
- 与地平面保持合适间距，必要时避免在器件下方放置大地铜箔以减小寄生电容对 SRF 的影响。
- 对于高频匹配，建议在实际频段用网络分析仪测量 S 参数并做微调。
- 额定电流为 1 A，长期工作时应留有裕量，若有连续高温或高电流脉冲，优先选择更大封装或更高额定电流型号。
- 遵循厂商推荐的回流焊工艺曲线，避免超温和长时间回流以保护元件可靠性。
五、选型参考与替代方案
- 需要更高 Q 或更低 DCR 时，考虑更大封装或功率级叠层/薄膜电感。
- 若工作频率接近或超过 SRF，应选用电感值更小或具有更高 SRF 的型号，或考虑用传输线技术替代电感实现所需阻抗。
- 对ESD或大电流冲击敏感的场合，评估是否加入限流保护或更换耐冲击元件。
六、可靠性与质量说明
叠层陶瓷结构适合回流焊组装，具有良好的温度循环与振动耐受性。常用于消费电子与通信设备的量产环境，生产一致性高。为确保长期可靠运行，建议在样片验证阶段进行温升、振动和热循环等可靠性测试。
结论：MLG1005S1N5BT000 在超小尺寸下提供可观的高频性能与较低损耗，适合用于射频匹配、滤波与偏置隔离等需兼顾体积与频率响应的应用场合。在设计时应注意 PCB 布局、热管理与电流裕量，以发挥其最佳性能。
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