Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK CGA2B1X7R1C104KT0Y0F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK CGA2B1X7R1C104KT0Y0F
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B1X7R1C104KT0Y0F
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0084327296
- Electronic Component
- X7R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CGA2B1X7R1C104KT0Y0F – TDK 贴片电容 (MLCC)
一、基本信息
CGA2B1X7R1C104KT0Y0F 是 TDK 公司制造的一种表面安装陶瓷电容器（MLCC），其具有高稳定性的电介质材料，适用于各种电子设备的电气滤波、耦合和旁路应用。该电容器的额定电压为 16V，容量为 100nF，公差为 ±10%，采用 0402 封装尺寸，使其非常适合高密度 PCB 设计。
二、产品特性
高性能电介质: CGA2B1X7R1C104KT0Y0F 的电介质材料采用 X7R（Temperature Coefficient of Capacitance）类型，能够在较大温度范围（-55°C 到 +125°C）内保持稳定的电容量，适合各种严苛环境条件。X7R 电介质也有良好的频率特性，确保产品在高频应用中表现稳定。
小型封装: 0402 的封装尺寸（1.0mm x 0.5mm）使得该电容器非常适用于现代小型化电子设备。其小巧的外形不仅节省了 PCB 空间，也为电路设计带来了更多设计灵活性。
可靠性: TDK 是全球知名的电子元器件制造商，产品经过严格的质量控制和测试，以确保其在不同工作条件下的可靠性和耐久性。CGA2B1X7R1C104KT0Y0F 在广泛应用中表现出色，能够满足高要求应用的需求。
电气特性:
- 容量: 100nF
- 电压: 16V
- 公差: ±10%
- 温度系数: X7R，具有优良的温度稳定性
- 介电强度: 高于标称电压，提供优秀的电压承受能力。
三、应用领域
CGA2B1X7R1C104KT0Y0F 的应用非常广泛，适用于多个电子设备和领域，包括但不限于：
消费电子: 适用于笔记本电脑、智能手机、平板电脑和其他便携式电子设备的电源管理，信号耦合和滤波。
工业设备: 在自动化设备、控制系统和传感器中，提供稳定的电源供应和信号处理，确保设备正常运行。
汽车电子: 作为电子控制单元（ECU）、车载娱乐系统及电池管理系统中的关键组件，支持高频信号的处理和电源的稳定性需求。
通讯设备: 被广泛用于基站、路由器及其他网络设备，确保信号的完整性和降低噪声。
四、总结
总之，CGA2B1X7R1C104KT0Y0F 作为一款高性能的贴片陶瓷电容器，凭借其稳定的电气特性、小型封装和广泛的应用领域，成为了众多电子设计师和工程师的优选组件。特别是在追求高效能和小型化的现代电子设备中，其重要性愈发突出。TDK 的品牌保证和质量控制，进一步增强了该产品在市场上的竞争力，让它成为高品质、高可靠性设计的理想选择。
如需采购或更多技术支持，TDK 提供详尽的产品手册和技术资源供设计师参考。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
