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TDK MLF1608A3R3KTA00
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLF1608A3R3KTA00
- Type
- TDK
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLF1608A3R3KTA00
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Inductor
- Electronic Component
- ±10%
- Electronic Component
- 0.032g
- Inductor
- 3.3uH
- Electronic Component
- 1
- Factor
- 35@10MHz
- Electronic Component
- BM0257286156
- Current
- 30mA
- Frequency
- 65MHz
- Resistor(DCR)
- 550mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLF1608A3R3KTA00 产品概述
一、概述
MLF1608A3R3KTA00 是东电（TDK）推出的一款屏蔽型多层片式电感，标称电感值为 3.3 µH，公差 ±10%，封装为 0603（1608 公制）。该器件针对体积受限、对电磁兼容与稳定性有要求的便携与消费类电子设计，提供小型化、高可靠性的滤波与能量储存功能。额定直流电流为 30 mA，典型直流电阻约 550 mΩ；品质因数 Q≈35（10 MHz），自谐振频率（SRF）约 65 MHz。
二、主要性能特点
- 小型化：0603 封装适用于高密度贴片布局，占用空间小，便于微型化产品设计。
- 屏蔽结构：屏蔽化设计有利于降低寄生辐射与耦合，改善 EMI 性能，适合对抗干扰环境。
- 高品质因数：Q≈35（@10MHz）表明在中高频段具有较低损耗，适用于滤波和阻抗匹配场合。
- 频率限制明确：自谐振频率约 65 MHz，超过此频率电感值会显著衰减，应避免在高于 SRF 的频段作为理想电感使用。
- 电阻与电流：典型 DCR≈550 mΩ，有文档列明的最大直流电阻值（规格书约束）需在选型时确认；额定电流 30 mA，适用于低电流通道。
三、典型应用场景
- 直流/低频滤波：用于模拟与数字电路的电源滤波、去耦与 EMI 抑制。
- 通信/射频前端：在需要屏蔽与中频滤波的场合，作为匹配或旁路元件（注意 SRF 限制）。
- 传感器与低功耗模块：对电流要求较低的传感器接口、蓝牙/无线模块的滤波电路。
- 移动与可穿戴设备：小尺寸与可靠性使其适合体积受限的便携产品。
四、封装与可靠性建议
- 封装：标准 0603（1608）表面贴装，兼容常规 SMT 贴装与回流焊流程。
- 焊接建议：采用温和的回流焊曲线，避免长时间过高温度或重复热循环导致性能漂移。
- 机械应力：在布局与波峰/回流焊后避免过度弯曲或机械冲击，贴片电感对焊盘设计与 PCB 刚性敏感。
- 环境与寿命：遵循厂商数据手册中关于温度范围、湿热及机械试验的要求以保证长期可靠性。
五、选型与使用注意事项
- 电流裕量：额定电流 30 mA 较低，设计时应保证实际工作电流远低于该值以避免饱和或温升。
- 工作频段选择：由于 SRF≈65 MHz，若工作频率接近或超过该值，应重新评估电感行为或选择更高 SRF 的元件。
- DCR 与损耗权衡：DCR 影响功耗与热升，需在热预算中考虑典型值与规格上限。
- 布局影响：靠近高速信号线或电源回路的布局会影响滤波效果，建议短回路、合理接地以发挥屏蔽优势。
如需完整规格书、尺寸图或可靠性数据（如最大 DCR、温度系数、焊接曲线与机械数据），请获取 TDK 官方数据手册以作最终设计验证。
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